High-precision automatic alignment ICT (In Circuit Tester)

Abstract

The invention discloses a high-precision automatic alignment ICT (In Circuit Tester). The high-precision automatic alignment ICT comprises a rack, a lower mold assembly, an upper mold assembly and an alignment adjusting platform, wherein the lower mold assembly comprises a supporting plate; an FPC (Flexible Printed Circuit) to be detected is arranged on the supporting plate; a CCD (Charge Coupled Device) camera is fixedly arranged at the position just above the FPC of the rack; the upper mold assembly comprises an upper mold entering-exiting air cylinder, an upper mold hoisting air cylinder, a pressing block and a thread needle seat unit; the alignment adjusting platform is provided with an adapter coupling plate; and the adapter coupling plate moves to the upper side of the FPC. According to the ICT provided by the invention, rapid detection and automatic alignment of the FPC can be realized through the matching of the CCD camera and the alignment adjusting platform, and a golden finger on the adapter coupling plate and a golden finger of the FPC are tightly pressed by a pressing block and are communicated; and the thread needle seat unit is communicated with a connector pin point of the FPC, so that an open circuit, a short circuit, a capacitor, a resistor, an inductor, a switch and the like of the FPC product can be rapidly tested and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of testing equipment, in particular to a high-precision automatic alignment ICT testing machine. Background technique [0002] ICT, that is, online testing, is a standard test method for checking manufacturing defects and defective components by testing the electrical properties and electrical connections of online components. It includes open circuits, short circuits, Component testing such as capacitance, resistance, inductance and switch. At present, the ICT testing machine mainly uses manual placement of the FPC, and manually judges the positional relationship between the gold finger of the adapter board and the FPC gold finger through the display screen, manually adjusts the alignment of the micrometer scale, and then presses down the upper and lower molds with the cylinder. To distinguish good products from defective products, because the size spacing of the gold fingers of the product is very small, the alignm...

AI Technical Summary

Problems solved by technology

At present, the ICT testing machine mainly uses manual placement of the FPC, and manually judges the positional relationship between the gold finger of the adapter board and the FPC gold finger through the display screen, manually adjusts the alignment of the micrometer scale, and then presses down the upper and lower molds with the cylinder. To distinguish good products from defective products, because the size spacing of the gold fingers of the product is very small, the alignment between the gold fingers of the adapter board and the gold fingers of the FPC must be manually adjusted and judged, so that the production efficiency is low and manual alignment is frequent. Placement of products leads to high labor intensity for workers, inaccurate alignment caused by human factors, increase in false detection of unqualified products, and low pass rate

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