High-power chip whole-film fixed resistor and production method thereof

A technology of fixed resistance and thin film resistance, used in thin film resistors, resistors, resistance manufacturing and other directions, can solve the problems of poor stability, low power, low precision, etc., and achieve the effects of good stability, reduced volume and high precision

Inactive Publication Date: 2016-03-02
株洲宏达电通科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0007] The object of the present invention is: in order to overcome the problems of low power, low precision and poor stability of existing high-power chip fixed resistors, the present invention provides a high-power chip full-film fixed resistor and its manufacturing method. The rated power of the 2512 si

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  • High-power chip whole-film fixed resistor and production method thereof

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[0024] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0025] figure 1 A schematic diagram of the basic structure of a high-power chip-type full-film fixed resistor is given. It can be seen from the accompanying drawings that the high-power chip-type full-film fixed resistor in the present invention includes an aluminum nitride substrate 1, an aluminum nitride substrate formed on the substrate The thin film resistance film layer 2 on the upper surface, the front and back electrode film layer 3 formed on the substrate, the secondary protective layer 4 located on the thin film resistance film layer, the thin film terminal electrode layer 5 sputtered on the end of the substrate, and the front and back electrode layer The nickel barrier layer 6 on the surface of the film layer and the film terminal electrode layer, and the tin-lead solderable layer 7 on the nickel barrier layer. A high-power chip-type full-fil...

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Abstract

The invention discloses a high-power chip whole-film fixed resistor and a production method thereof. The high-power chip whole-film fixed resistor comprises a substrate, a film resistive film layer, a front and back electrode film layer, a film end electrode layer, a nickel barrier layer and a tin and lead weldable layer. The high-power chip whole-film fixed resistor takes the aluminum nitride substrate as a carrier, a metal alloy is adopted as the film resistive film layer, metallic copper is adopted as the front and back electrode film layer; the metal alloy and the metallic copper are sputtered with the magnetron sputtering technology; thermal treatment and thermal stability technologies are adopted to improve stability and thermal resistance; the laser resistor trimming technology is adopted for resistance correction. The high-power chip whole-film fixed resistor is high in power, high in accuracy and good in stability. The 2512-size product has the rated power up to 4 W and the resistance ranging from 1 omega to 10 M omega, so that the weight of electronic equipment is obviously decreased, and the size of the electronic equipment is obviously reduced.

Description

technical field [0001] The invention relates to the technical field of chip-type fixed resistors, in particular to a high-power chip-type thin-film fixed resistor and a manufacturing method thereof. Background technique [0002] At present, with the development of electronic technology and military electronic components, as well as the needs of miniaturization, light weight and high performance of modern weapons and equipment, higher requirements are put forward for the performance index and reliability of electronic components. As an important basic electronic component, resistors are widely used in the surface mount of small complete electronic equipment such as mobile communications, notebook computers, handheld computers, computers, and automotive electronics. It is widely used in the circuit of electronic whole machine. [0003] There are two types of chip-type fixed resistors: chip-type thick-film fixed resistors and chip-type thin-film fixed resistors. Chip thick fi...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C17/00H01C17/075H01C17/12
CPCH01C7/006H01C17/00H01C17/075H01C17/12
Inventor 赵伟利刘宏
Owner 株洲宏达电通科技有限公司
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