A kind of copper sinking technology for slot hole of high-density laminated board pi resin board
A laminated board, high-density technology, applied in the electrical connection formation of printed components, electrical components, printed circuit manufacturing, etc., can solve the problems of hole wall separation defects, insertion and welding, high cost of plasma equipment, etc., to reduce production costs , The effect of improving the yield
Active Publication Date: 2018-05-25
TIANJIN PRINTRONICS CIRCUIT CORP
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Problems solved by technology
[0002] High-density laminate is a new type of circuit board with high integration and good stability. With the development of science and technology, the heat resistance, dimensional stability, moisture resistance, chemical resistance and other properties of circuit boards are greatly improved. The requirements are getting higher and higher, especially in aerospace, oil drilling probe and other industries, the traditional epoxy resin system FR4 sheet can no longer meet the performance requirements, and polyimide resin (PI resin) has a higher glass State transition temperature (Tg260°C) and high thermal cracking temperature (Td>400°C) and very good dimensional stability (CTE), which are increasingly used in special application scenarios
[0003] In the slotted copper sinking process of circuit boards, the steps include: mechanical drilling, deburring, glue removal, copper sinking, electroplating, and outer layer image transfer. The glue removal is the use of swelling agent M-AQ, sodium hydroxide , Potassium permanganate, sulfuric acid and water for comprehensive treatment, and then use the sinking copper process for slot hole sinking processing, but there are great differences between PI resin and traditional epoxy resin in physical and chemical properties, using traditional chemical glue removal The PI resin is treated by the copper sinking process. In the final thermal stress reliability test, the slots appear as figure 1 The serious hole wall separation defect shown makes it impossible to insert and solder components in the later stage, resulting in the scrapping of batch products
Method used
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[0032] Below in conjunction with the examples, the present invention is further described, the following examples are illustrative, not limiting, and the protection scope of the present invention cannot be limited by the following examples.
[0033] A kind of high-density laminated board PI resin board slot hole copper sinking process, such as Figure 1~4 As shown, including mechanical drilling, deburring, copper sinking and electroplating, it is characterized in that: the baking plate of the plate, the first degumming and the second degumming are carried out between the deburring and copper sinking steps, the described Flash plating of the plate between copper sinking and electroplating steps;
[0034] Described baking plate comprises the following steps:
[0035] ⑴ Put the drilled circuit board into an electric oven and heat up to 170 degrees Celsius;
[0036] (2) After 3 to 5 hours on the constant temperature baking plate, cool down to room temperature naturally;
[0037...
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The invention relates to a slotted hole electroless copper planting process of a PI resin sheet material of a high-density laminated board. Sheet material baking, primary glue removing, and secondary glue removing are carried out between steps of burring and electroless copper planting; and sheet material flashing is carried out between steps of electroless copper planting and electroplating. According to the invention, because the PI resin is formed by resin, glass fibers, and filling materials, after baking and glue removing twice, the resin and the glass fibers at the side wall of the slotted hole are processed roughly, thereby enhancing the combining force of the fracture surface and the plating copper. Moreover, because the rough fracture surface is not easy to electroplate, flashing is carried out before electroplating and thus the fracture surface of the slotted hole is plated with a plating layer, thereby guaranteeing normality of the follow-up electroplating process. After slicing testing, no new device is added after novel technology is employed; and a defect of separation of the hole and the wall is overcome after slotted hole metallization, so that the yield of the batch of products is improved and the production cost is reduced.
Description
technical field [0001] The invention belongs to the field of copper sinking technology for PI resin slot holes of high-density laminates, in particular to a copper sinking technology for slot holes of PI resin plates of high-density laminates. Background technique [0002] High-density laminate is a new type of circuit board with high integration and good stability. With the development of science and technology, the heat resistance, dimensional stability, moisture resistance, chemical resistance and other properties of circuit boards are greatly improved. The requirements are getting higher and higher, especially in aerospace, oil drilling probe and other industries, the traditional epoxy resin system FR4 plate can no longer meet the performance requirements, and polyimide resin (PI resin) has a higher glass State transition temperature (Tg260°C), high thermal cracking temperature (Td>400°C) and very good dimensional stability (CTE), which are increasingly used in specia...
Claims
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IPC IPC(8): H05K3/42
CPCH05K3/42H05K2203/0766H05K2203/0773H05K2203/143
Inventor 吴云鹏
Owner TIANJIN PRINTRONICS CIRCUIT CORP