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Alkaline polishing method during production of passivated emitter rear contact (PERC) crystalline silicon solar cell

A solar cell and crystalline silicon technology, applied in the field of alkali polishing, can solve the problems of complex production process, poor passivation effect of the back surface, poor controllability, etc.

Active Publication Date: 2016-03-23
JINENG CLEAN ENERGY TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an alkali polishing method that can use the alkali polishing process in the production of PERC crystalline silicon solar cells in the existing PERC cell production process, so that it can improve the complex production process in the current alkali polishing process. , Defects of poor controllability, to solve the problems of poor passivation effect on the back surface caused by the winding plating of the front film layer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Take 800pcs of monocrystalline silicon wafers, and prepare a textured surface with a weight removal of 0.4-0.8g through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, a texturing time of 1100s, and a temperature of 80°C; POCl3 is used as a phosphorus source , the deposition and advance time are 15min and 13min respectively, and the temperature is about 830°C for diffusion; the PN junction between the edge and the back is removed through an etching tank with a liquid volume ratio of HNO3:HF=10:1; the front side is PECVD-coated with silicon nitride film, the deposition thickness is 70-90nm, the coating temperature is about 450°C; the belt speed is 2.3m / min, and the volume ratio of the solution is HNO3:HF=10:1. The NaOH alkali tank with a fraction of 17.6% is used for polishing the back surface; the aluminum oxide film is coated on the back by atomic layer deposition (ALD), and the deposition thickness is about 10nm; then the silicon nitride is coated on th...

Embodiment 2

[0015] Take 800pcs of monocrystalline silicon wafers, and prepare a textured surface with a weight removal of 0.4-0.8g through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, a texturing time of 1100s, and a temperature of 80°C; POCl3 is used as a phosphorus source , the deposition and advance time are 15min and 13min respectively, and the temperature is about 830°C for diffusion; the PN junction between the edge and the back is removed through an etching tank with a liquid volume ratio of HNO3:HF=10:1; the front side is PECVD-coated with silicon nitride film, the deposition thickness is 70-90nm, the coating temperature is about 450°C; the belt speed is 1.8m / min, and the volume ratio of the solution is HNO3:HF=10:1, etch to remove the back surface and the edge around the silicon nitride after the volume fraction Polish the back surface of the 17.6% NaOH alkali tank; through atomic layer deposition (ALD), the aluminum oxide film is deposited on the back, and the ...

Embodiment 3

[0017] Take 800pcs of monocrystalline silicon wafers, and prepare a textured surface with a weight removal of 0.4-0.8g through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, a texturing time of 1100s, and a temperature of 80°C; POCl3 is used as a phosphorus source , the deposition and advance time are 15min and 13min respectively, and the temperature is about 830°C for diffusion; the PN junction between the edge and the back is removed through an etching tank with a liquid volume ratio of HNO3:HF=10:1; the front side is PECVD-coated with silicon nitride film, the deposition thickness is 70-90nm, the coating temperature is about 450°C; the belt speed is 1.8m / min, and the liquid volume ratio is HNO3:HF=4:1, etch and remove the back surface and edge around the silicon nitride after the volume fraction Polish the back surface of the 17.6% NaOH alkali tank; through atomic layer deposition (ALD), the aluminum oxide film is deposited on the back, and the deposition th...

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PUM

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Abstract

The invention belongs to a manufacturing technique of a solar cell, and relates to an alkaline polishing method during production of a passivated emitter rear contact (PERC) crystalline silicon solar cell. The method comprises the following steps of carrying out conventional processes of etching, diffusion and groove etching on a single-silicon wafer to remove positive-negative (PN) junctions at an edge and a back surface and plating of a silicon nitride film on a front surface by plasma enhanced chemical vapor deposition (PECVD), etching to remove silicon nitride plated on the back surface and at the edge in a rolling way by a belt driving way, and then carrying out polishing processing on the back surface through an alkaline groove; and depositing an aluminum oxide plated thin film on the back surface by an atomic layer, and carrying out conventional processes of laser grooving, metal paste silk-screen printing on the front surface and the back surface and sintering to prepare a PERC battery piece. The alkaline polishing process is integrated into the traditional PERC battery production process, the problems of complicated production process during the current introduction process of alkaline polishing, poor controllability, poor back surface passivation effect caused by plating a film layer on the front surface in a rolling way and the like are solved, so that the production the PERC battery based on alkaline polishing can meet the requirement of yield better.

Description

technical field [0001] The invention belongs to the manufacturing technology of solar cells, and relates to an alkali polishing method in the production of PERC crystalline silicon solar cells. Background technique [0002] With the continuous improvement of crystalline silicon solar cell technology, the mass production conversion efficiency of monocrystalline silicon solar cells with traditional structure has reached 19.2%, and the mass production conversion efficiency of polycrystalline silicon solar cells has reached 17.8%. There is not much room for improvement in the efficiency of cells with traditional structures, and the improvement of cell efficiency must rely on the development of crystalline silicon solar cells with new structures. In the current high-efficiency silicon-based cell technology, since the passivated emitter and rear surface cell (PERC cell) moves the process of improving cell efficiency to the back of the cell, it is compatible with other high-efficie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/068H01L31/18
CPCH01L31/068H01L31/1804Y02E10/547Y02P70/50
Inventor 黄金李高非王继磊付少剑张娟白炎辉
Owner JINENG CLEAN ENERGY TECH LTD
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