Alkaline polishing method during production of passivated emitter rear contact (PERC) crystalline silicon solar cell
A solar cell and crystalline silicon technology, applied in the field of alkali polishing, can solve the problems of complex production process, poor passivation effect of the back surface, poor controllability, etc.
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Embodiment 1
[0013] Take 800pcs of monocrystalline silicon wafers, and prepare a textured surface with a weight removal of 0.4-0.8g through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, a texturing time of 1100s, and a temperature of 80°C; POCl3 is used as a phosphorus source , the deposition and advance time are 15min and 13min respectively, and the temperature is about 830°C for diffusion; the PN junction between the edge and the back is removed through an etching tank with a liquid volume ratio of HNO3:HF=10:1; the front side is PECVD-coated with silicon nitride film, the deposition thickness is 70-90nm, the coating temperature is about 450°C; the belt speed is 2.3m / min, and the volume ratio of the solution is HNO3:HF=10:1. The NaOH alkali tank with a fraction of 17.6% is used for polishing the back surface; the aluminum oxide film is coated on the back by atomic layer deposition (ALD), and the deposition thickness is about 10nm; then the silicon nitride is coated on th...
Embodiment 2
[0015] Take 800pcs of monocrystalline silicon wafers, and prepare a textured surface with a weight removal of 0.4-0.8g through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, a texturing time of 1100s, and a temperature of 80°C; POCl3 is used as a phosphorus source , the deposition and advance time are 15min and 13min respectively, and the temperature is about 830°C for diffusion; the PN junction between the edge and the back is removed through an etching tank with a liquid volume ratio of HNO3:HF=10:1; the front side is PECVD-coated with silicon nitride film, the deposition thickness is 70-90nm, the coating temperature is about 450°C; the belt speed is 1.8m / min, and the volume ratio of the solution is HNO3:HF=10:1, etch to remove the back surface and the edge around the silicon nitride after the volume fraction Polish the back surface of the 17.6% NaOH alkali tank; through atomic layer deposition (ALD), the aluminum oxide film is deposited on the back, and the ...
Embodiment 3
[0017] Take 800pcs of monocrystalline silicon wafers, and prepare a textured surface with a weight removal of 0.4-0.8g through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, a texturing time of 1100s, and a temperature of 80°C; POCl3 is used as a phosphorus source , the deposition and advance time are 15min and 13min respectively, and the temperature is about 830°C for diffusion; the PN junction between the edge and the back is removed through an etching tank with a liquid volume ratio of HNO3:HF=10:1; the front side is PECVD-coated with silicon nitride film, the deposition thickness is 70-90nm, the coating temperature is about 450°C; the belt speed is 1.8m / min, and the liquid volume ratio is HNO3:HF=4:1, etch and remove the back surface and edge around the silicon nitride after the volume fraction Polish the back surface of the 17.6% NaOH alkali tank; through atomic layer deposition (ALD), the aluminum oxide film is deposited on the back, and the deposition th...
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