Metal-based copper-clad plate with low thermal resistance

Abstract

The invention discloses a metal-based copper-clad plate with low thermal resistance. The metal-based copper-clad substrate comprises a metal substrate arranged at the bottom, wherein the upper surface of the metal substrate is rectangular; an electroconductive copper foil layer is arranged above the metal substrate; the upper surface of the copper foil layer is coated with a heat conducting epoxy resin layer; the upper surface of the heat conducting epoxy resin layer is coated with a weld membrane; a heat sink is pressed on and covers the weld membrane; and cooling holes are formed in the heat sink. Through arranging the heat conducting epoxy resin layer, the metal-based copper-clad plate has excellent peeling strength and heat resistance and the heat conductivity of the metal-based copper-clad plate can be improved; meanwhile, since a metalized circuit layer with heat conductivity and weldability is formed on the metal substrate, the metal-based copper-clad plate has good heat dispersion performance; through arrangement of the heat sink and the cooling holes, heat resistance can be reduced to the great extent and the use of a large quantity of material with low heat resistance is avoided.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a metal-based copper-clad board with low thermal resistance. Background technique [0002] With the rapid development of the electronics industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher. Solving the problem of heat dissipation is a huge challenge for the design of the electronics industry. Metal-based copper clad laminate is undoubtedly one of the effective means to solve the problem of heat dissipation. Metal-based copper clad laminate is a copper clad laminate with good heat dissipation function. It is composed of a unique three-layer structure, which are circuit layer, thermal insulation layer and metal base layer. The working principle of the metal-based copper-clad laminate is: the surface of the power device is mounted on the circuit layer, and the heat generated by the device is conducted t...

AI Technical Summary

Problems solved by technology

Due to the unsatisfactory heat dissipation performance of the metal substrate and the heat-conducting and insulating adhesive layer, and because the bonding between the surface of the metal substrate and the resin of the heat-dissipating and insulating adhesive layer is not firm enough, the metal substrate and the heat-conducting and insulating adhesive layer are easily separated, and the withstand voltage is low, which is easy Breakdown and other problems will seriously affect its durable performance, especially when it is used as an LED lighting substrate and a high-power inverter circuit substrate, due to overheating of the substrate, it will cause light failure or even burn out the LED light-emitting diode

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