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Circuit board and semiconductor device

A technology for circuit substrates and circuit boards, which is applied to semiconductor devices, circuits, and semiconductor/solid-state device components, etc., and can solve problems such as reducing the degree of freedom of circuit design.

Active Publication Date: 2017-05-03
KK TOSHIBA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the degree of freedom in circuit design decreases

Method used

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  • Circuit board and semiconductor device
  • Circuit board and semiconductor device
  • Circuit board and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6、 comparative example 1～3

[0073] First, a ceramic substrate is prepared. Table 1 shows the types of ceramic substrates in each of Examples 1-6 and Comparative Examples 1-3. In addition, as a silicon nitride substrate, a silicon nitride substrate having a thermal conductivity of 90 W / m·K, a three-point bending strength of 700 MPa, and a length of 50 mm×width 35 mm×thickness of 0.32 mm was prepared. As an aluminum nitride substrate, an aluminum nitride substrate having a thermal conductivity of 190 W / m·K, a three-point bending strength of 360 MPa, and a length of 50 mm×width 35 mm×thickness of 0.635 mm was prepared. As an alumina substrate, an alumina substrate having a thermal conductivity of 20 W / m·K, a three-point bending strength of 500 MPa, and a length of 50 mm×width 35 mm×thickness of 1.0 mm was prepared.

[0074] Next, 65% by mass of Ag powder, 30% by mass of Cu powder, 5% by mass of Ti powder, and an organic solvent were mixed to prepare an active metal solder paste in which the total of Ag, Cu...

Embodiment 7～10

[0084] First, as a ceramic substrate, a silicon nitride substrate having a length of 50 mm×a width of 35 mm×a thickness of 0.32 mm was prepared. Table 3 shows the thermal conductivity and three-point bending strength of the silicon nitride substrates of Examples 7 to 10.

[0085] [table 3]

[0086]

[0087] Next, 60% by mass of Ag powder, 26% by mass of Cu powder, 10% by mass of Sn powder, 4% by mass of Ti powder, and an organic solvent are mixed to prepare the total amount of Ag, Cu, Sn, and Ti as 100% by mass. Active metal solder paste. In addition, each average particle diameter of Ag powder, Cu powder, Sn powder, and Ti powder was 2 micrometers.

[0088] Second, prepare the copper circuit board. Table 4 shows the dimensions (length (mm) x width (mm) x thickness (mm)) of the copper circuit boards of Examples 7 to 10 and the angle θ of the internal angle of the cross section. In addition, the copper circuit board is processed to the target size by die stamping or cutt...

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Abstract

To provide a circuit substrate with high TCT reliability and a high degree of freedom in circuit design. Equipped with: a ceramic substrate; disposed on at least one of the first surface and the second surface of the ceramic substrate, having a thickness T (mm) of 0.7mm or more, an angle θ of an internal angle of a cross-section of 85° to 95°, and setting The copper circuit board of the semiconductor element mounting part of 25 mm2 or more on the surface; and the bonding layer for bonding the ceramic substrate and the copper circuit board. The bonding layer has an exposed portion that is exposed to the outside of the copper circuit board and is provided so as to climb up along the side surface of the copper circuit board, and has an exposure amount W1 of 0.1mm to 1.0mm and 0.05T (mm) or more Climbing amount W2 below 0.6T (mm).

Description

technical field [0001] Embodiments generally relate to circuit boards and semiconductor devices. Background technique [0002] In recent years, power modules for controlling large currents and high voltages have been used in electric vehicles, trains, and the like from the viewpoint of high performance of industrial equipment and global environmental issues. In addition, as semiconductor elements, development of semiconductor elements such as SiC elements having high output is progressing. In addition, as the output of semiconductor elements is increased, circuit boards having excellent durability are required as circuit boards on which semiconductor elements are mounted. [0003] Examples of the circuit board include an insulating circuit board including a ceramic substrate and a metal circuit board, and the like. The reliability of the circuit board is evaluated by TCT (Temperature Cycle Test: TCT, temperature cycle test). TCT refers to the following inspection method: ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14C04B37/02B23K1/00B23K1/19H01L23/12H01L23/13H01L23/36H05K3/38B23K101/42
CPCB23K1/19H05K3/38B23K1/0016B23K20/026B23K20/16B23K20/233H01L23/15H01L23/3735H05K1/0306H01L2924/0002H05K2203/1105B23K2101/42B23K2103/12B23K2103/18B23K2103/52C04B2237/59C04B37/023C04B37/026C04B2237/12C04B2237/122C04B2237/124C04B2237/125C04B2237/343C04B2237/366C04B2237/368C04B2237/407C04B2237/60C04B2237/88H01L2924/00
Inventor 加藤宽正星野政则
Owner KK TOSHIBA