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Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar

An electronic, electrical, copper alloy technology, applied in electrical components, metal/alloy conductors, circuits, etc., can solve problems such as burrs, easy mold wear, and multiple punching chips, and achieves suppression of electrical conductivity. Deformation and Vickers hardness improvement effect

Active Publication Date: 2016-03-30
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Here, the above-mentioned Cu-Zr alloy has a composition close to that of pure copper in order to ensure high electrical conductivity, and has high ductility, but its shear workability is not good.
If it is described in detail, there is a problem that burrs are generated during press punching, and punching with high dimensional accuracy cannot be performed.
In addition, there is also the problem that the die is easy to wear or there is a problem that a lot of punching chips are generated

Method used

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  • Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar
  • Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar
  • Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar

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Experimental program
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Effect test

Embodiment

[0133] Hereinafter, the results of confirmatory experiments conducted to confirm the effects of the present invention will be described.

[0134] A copper raw material composed of oxygen-free copper (ASTMF68-Class 1) with a purity of 99.99% by mass or higher was prepared, and the copper raw material was placed in a high-purity graphite crucible, and high-frequency melting was performed in an atmosphere furnace set to an Ar gas atmosphere . Various additive elements were added to the obtained molten copper to prepare the component compositions shown in Table 1 and Table 2, and poured into a water-cooled copper mold to produce ingots. In addition, the size of the ingot was about 20 mm in thickness×about 20 mm in width×about 100 to 120 mm in length.

[0135] The obtained ingot was subjected to a heat treatment process of heating for 4 hours under the temperature conditions described in Table 3 and Table 4 for homogenization and solid solution in an Ar gas atmosphere, and then wa...

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Abstract

The present invention relates to a copper alloy for electronic / electrical devices, a copper alloy thin plate for electronic / electrical devices, a component for electronic / electrical devices, a terminal and a bus bar. The copper alloy for electronic / electrical devices has a composition that contains 0.01 mass% or more but less than 0.11 mass% of Zr and 0.002 mass% or more but less than 0.03 mass% of Si with the balance made up of Cu and unavoidable impurities. The ratio of the Zr content (mass%) to the Si content (mass%), namely Zr / Si is set to be within the range from 2 to 30 (inclusive).

Description

technical field [0001] The present invention relates to a copper alloy for electrical and electronic equipment used as components for electrical and electronic equipment such as connectors of semiconductor devices, other terminals, movable conductive sheets of electromagnetic relays, lead frames, and bus bars, and copper alloys for electrical and electronic equipment using the copper alloy for electrical and electronic equipment. Alloyed copper alloy sheets for electrical and electronic equipment, parts, terminals and busbars for electrical and electronic equipment. [0002] This application claims priority based on Patent Application No. 2013-167829 for which it applied in Japan on August 12, 2013, and uses the content here. Background technique [0003] In the past, with the miniaturization and weight reduction of electronic equipment, electrical equipment, etc., the miniaturization and thinning of electrical and electronic equipment parts such as terminals such as connect...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C9/01C22C9/02C22C9/04C22C9/05C22C9/06C22C9/08C22C9/10C22F1/00C22F1/08H01B1/02H01B5/00H01B5/02H01R13/03
CPCC22C9/00C22F1/08H01R13/03H01B1/026C22C9/02
Inventor 牧一诚松永裕隆有泽周平
Owner MITSUBISHI MATERIALS CORP