Plating method for iron-nickel alloy frame

Abstract

The invention discloses a plating method for an iron-nickel alloy frame. The plating method comprises the following steps that 1, the iron-nickel alloy frame is fixed, specifically, the iron-nickel alloy frame is fixedly hung on a bracket; 2, cathode-anode combined degreasing is conducted; 3, pickling is carried out; 4, copper pre-plating is conducted; 5, copper plating is conducted, specifically, the iron-nickel alloy frame subjected to copper pre-plating treatment is put into a copper sulfate electrolytic solution to be used as a cathode, a copper plate serves as an anode, and a power source is connected; after copper plating is finished, the iron-nickel alloy frame is washed by clear water for the third time; 6, copper protecting is carried out, specifically, the bracket is put in a copper protective agent solution, and it is ensured that the iron-nickel alloy frame is immersed into the solution entirely; a layer of colorless and transparent thin film is formed on the surface of the iron-nickel alloy frame; and 7, drying is carried out, specifically, the iron-nickel alloy frame is taken down from the bracket, and the plating process is completed. The iron-nickel alloy leading wire frame obtained through the plating method has the advantages that the conductive performance is good, and the production and use standards of a semiconductor chip are met.

Description

technical field [0001] The invention relates to a method for manufacturing a lead frame, in particular to a method for electroplating an iron-nickel alloy frame. Background technique [0002] With the development of science and technology, the production and demand of digital products are increasing day by day, the demand for semiconductor electronic components is increasing day by day, and they tend to be miniaturized. It will cause defects such as insufficient strength, low production efficiency, and difficulty in improving traction during the production process. In order to solve the above problems, manufacturers use iron-nickel alloys as raw materials to produce lead frames, but the existing technology of electroplating iron-nickel alloy lead frames cannot be used after electroplating. Guaranteed its electrical conductivity performance, does not meet the standards for the use of semiconductor chips. Contents of the invention [0003] The purpose of the present inventi...

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Problems solved by technology

[0002] With the development of science and technology, the production and demand of digital products are increasing day by day, the demand for semiconductor electronic components is increasing day by day, and they tend to be miniaturized. It will cause defects such as insufficient strength, low production efficiency, and difficulty in improving traction during the production process. In order to solve the above problems, manufacturers use iron-nickel alloys as raw materials to produce lead frames, but the existing technology of electroplating iron-nickel alloy lead frames cannot be used after electroplating. Guarantee its electrical conductivity performance, does not meet the use standards of semiconductor chips

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