Electrode of metal powder substrate inductor and preparation method of electrode

A metal powder and inductor technology, applied in the manufacture of inductors/transformers/magnets, chemical instruments and methods, transformers/inductor coils/windings/connections, etc., can solve the problem that inductors are not easily resistant to high temperatures and the production cost of inductors increases , Damage to the inductor body and other issues, to achieve the effect of enhancing installation reliability, improving electrode adhesion, and improving yield

Inactive Publication Date: 2016-04-06
ZHONGSHAN YINSAISHITE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, silver paste is mainly used as the bottom electrode material in the manufacturing process of the terminal electrode of the inductor. After deglue, it is more than 90% pure silver. However, with the rapid economic development in recent years, the price of raw materials has risen greatly. In particular, the price of silver paste has risen more rapidly. Affected by the rise in the price of silver paste, the production cost of inductors has increased significantly, which has brought great difficulties to production and operation.
[0005] On the other hand, in recent years, metal powder matrix (iron, nickel, chromium, aluminum, etc.) electrode, when the conductive silver paste is sintered at high temperature, it will damage the inductor body
Therefore, the above method is also not suitable for metal powder matrix inductors

Method used

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  • Electrode of metal powder substrate inductor and preparation method of electrode

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Embodiment 1

[0027] This embodiment provides an electrode of a metal powder matrix inductor, such as figure 1 As shown, it is arranged at the electrode of the inductor 1, and the electrode includes a base layer 11, a conductive layer 12 and a tin layer 13 stacked on the electrode in sequence, wherein the base layer 11 is provided by electroplating at the electrodes.

[0028] The base layer 11 is a conductive metal layer, such as zinc, copper, nickel or silver layer, preferably copper.

[0029] The conductive layer 12 can be a conductive metal layer, such as copper, nickel or silver layer; it can also be a conductive alloy layer, such as nickel-chromium alloy or copper-tin alloy.

[0030] The conductive layer 12 can be one layer, or multiple layers stacked.

Embodiment 2

[0032] This embodiment provides a method for preparing the electrode of the metal powder matrix inductor described in Embodiment 1, which includes the following steps:

[0033] Mask all or part of the inductor (including electrodes and non-electrodes);

[0034] Remove the mask at the electrode at the bottom, so that the bottom of the inductor is not exposed except for the electrode, and only the electrode is exposed;

[0035] electroplating a base film 11 at the electrodes;

[0036] A conductive layer 12 and a tin layer 13 are sequentially prepared on the surface of the base film 11 .

[0037] The conductive layer 12 can be a conductive metal layer, such as copper, nickel or silver layer; it can also be a conductive alloy layer, such as nickel-chromium alloy or copper-tin alloy.

[0038] The base layer 11 is a conductive metal layer, such as: zinc, copper, nickel or silver layer;

[0039] The conductive layer 12 can be one layer, or multiple layers stacked.

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Abstract

The invention provides an electrode of a metal powder substrate inductor. The electrode is arranged at an electrode of an inductor. The electrode comprises a base layer, a conductive layer and a tin layer which are sequentially laminated at the electrode, and the base layer is arranged at the electrode through an electroplating mode. The invention also provides a preparation method for the electrode of the metal powder substrate inductor. The preparation method comprises the following steps of fully or partially masking the inductor; removing a mask at the electrode of the inductor; preparing the base layer at the electrode; and sequentially preparing the conductive layer and the tin layer on the surface of the base layer. By reducing the usage of precious metal and the energy consumption in a process, the preparation cost of a conventional electrode process is substantially reduced, the electrode adhesive force is improved, the installation reliability of the electrode is enhanced, the preparation process is simplified, the yield of mass production is improved, the corrosion resistant capability of a metal powder substrate is improved, and the service life of a device is prolonged.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to an electrode of a metal powder matrix inductor and a preparation method thereof. Background technique [0002] Inductor is a component that can convert electrical energy into magnetic energy and store it. Inductors are similar in construction to transformers, but with only one winding. Inductors have a certain inductance, which only resists changes in current. If the inductor is in a state where no current is flowing, it will try to block the current from flowing through it when the circuit is on; if the inductor is in a state where current is passing, it will try to maintain the current when the circuit is off. [0003] In recent years, the field of electronic products has developed rapidly, and circuit boards, such as PCBs, are necessary components of electronic products, and inductors on PCB boards are electronic components with a very high usage rate. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/29H01F41/00B32B15/01
CPCH01F27/29B32B15/01H01F41/00
Inventor 牛辉陈智军
Owner ZHONGSHAN YINSAISHITE ELECTRONICS TECH CO LTD
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