Manufacturing technology of expansion and shrinkage resisting insulation mirror plate

Abstract

The invention discloses a manufacturing technology of an expansion and shrinkage resisting insulation mirror plate. The manufacturing technology comprises the steps that an aluminum plate is immersed into an electrolytic cell with an electrolyte and serves as an anode, a stainless steel plate serves as a cathode, micro-arc oxidation is carried out under the set conditions so that an oxidation film can be formed on the surface of the aluminum plate, and according to the specific set conditions, the voltage ranges from 480 V to 500 V, the current density ranges from 18 A / dm<2> to 20 A / dm<2>, the temperature of the electrolyte ranges from 32 DEG C to 35 DEG C, and the reaction time ranges from 20 min to 25 min; and the electrolyte comprises 22-24 g / L of potassium sulphate, 4-5 g / L of sodium borate and 1-2 g / L of sodium oxalate. According to the scheme, the micro-arc oxidation technology is adopted so that a compact oxidation film layer can be formed on the surface of the aluminum plate, high-frequency use of the insulation mirror plate can be guaranteed during hot pressing at a high temperature and a high pressure through the oxidation film layer, no expansion or shrinkage happens, the surface is flat and resistant to wear, and no sinking happens.

Description

technical field [0001] The invention relates to a preparation process of an insulating mirror plate, in particular to a preparation process of an anti-expansion and shrinkage insulating mirror plate based on micro-arc oxidation. Background technique [0002] When manufacturing the main substrate of the circuit board (PCB), it is necessary to use a voltage machine to laminate multiple layers of different materials. The working principle of this voltage machine is to heat the processed glue through copper foil (or aluminum foil) Adhesive resin material, and press the multi-layer material by applying a certain pressure for at least half an hour, so as to make the circuit board base material, and in the process of pressing with an electric machine, due to cost considerations, a single pressing operation often needs to be done at the same time. Pressing multiple pieces of circuit board substrates, and in order to prevent multiple pieces of circuit board substrates from being affe...

AI Technical Summary

Problems solved by technology

[0003] The biggest difference between the mirror plate and the ordinary insulating plate is that there is a dense oxide film on the surface, which has a great influence on the performance of the mirror plate. In the lamination process, the performance requirements of the mirror plate are very high. When the machine is in operation, it generates both high temperature heat (greater than 300°C) and strong pressure (greater than 50MPa), which requires the mirror plate to have excellent thermal pressure resistance, that is, the mirror plate needs to have a high limit resistance Temperature and ultimate pressure resistance, and, more importantly, the surface of the mirror plate must remain very flat and smooth after repeated hot pressing, with no depressions on the surface, no expansion and contraction, and currently in the existing process However, this requirement cannot be realized in the current technology. Generally, after the mirror plate of the prior art can be used for about 100 times at room temperature, the surface begins to be sunken, resulting in the failure of the mirror plate, and it can only be used for about 50 times at high temperature. expired

Another reason why the existing technology cannot meet this requirement is that the preparation technology of this oxide film is not yet mature.

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