Thermosetting high-strength acrylate adhesive
A technology of acrylate and methyl methacrylate, which is applied in the field of thermosetting high-strength acrylate adhesives, can solve the problems of poor strength, corrosion resistance and impact resistance, and achieve good impact resistance and high The effect of intensity
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Embodiment 1
[0022] In parts by mass, the formula used in this embodiment is:
[0023] Resin components:
[0024] 20 parts of epoxy modified acrylic resin
[0025] 45 parts of methyl methacrylate
[0026] Chlorosulfonated polyethylene 20 parts
[0027] 6 parts methacrylic acid
[0028] Aluminum acetylacetonate 3 parts
[0029] Allyl methacrylate 1.4 parts
[0030] 0.4 parts of hydrogen peroxide
[0031] 0.2 parts of tris[2.4-di-tert-butylphenyl]phosphite
[0032] Curing agent components:
[0033] Butyraldehyde aniline condensate 100 parts
[0034] The preparation process steps and conditions of the present embodiment are:
[0035] 1. 20 parts by weight of epoxy-modified acrylic resin, which is realized in Example 3 of CN201010297437.8, is dissolved with 45 parts of methyl methacrylate until it is completely transparent;
[0036] 2. Mix and stir 20 parts of chlorosulfonated polyethylene and 6 parts of methacrylic acid evenly, then add 3 parts of aluminum acetylacetonate, 0.2 parts...
Embodiment 2
[0039] In parts by mass, the formula used in this embodiment is:
[0040] Resin components:
[0041] 15 parts epoxy modified acrylic resin
[0042] 45 parts of methyl methacrylate
[0043] Chlorosulfonated polyethylene 25 parts
[0044] 8 parts methacrylic acid
[0045] Aluminum acetylacetonate 2 parts
[0046] Allyl methacrylate 2.6 parts
[0047] 0.3 parts of hydrogen peroxide
[0048] 0.1 parts of tris[2.4-di-tert-butylphenyl]phosphite
[0049] Curing agent components:
[0050] Butyraldehyde aniline condensate 100 parts
[0051] The preparation process steps and conditions of the present embodiment are:
[0052] 1. 15 parts by weight of epoxy-modified acrylic resin is used to realize the resin in Example 1 of CN201010297437.8, and dissolved with 45 parts of methyl methacrylate until it is completely transparent;
[0053] 2. Mix and stir 25 parts of chlorosulfonated polyethylene and 8 parts of methacrylic acid evenly, then add 2 parts of aluminum acetylacetonate, 0...
Embodiment 3
[0056] In parts by mass, the formula used in this embodiment is:
[0057] Resin components:
[0058] 12 parts epoxy modified acrylic resin
[0059] 45 parts of methyl methacrylate
[0060] Chlorosulfonated polyethylene 25 parts
[0061] 12 parts of methacrylic acid
[0062] Aluminum acetylacetonate 2 parts
[0063] Allyl methacrylate 1.0 parts
[0064] 0.6 parts of hydrogen peroxide
[0065] 0.4 parts of tris[2.4-di-tert-butylphenyl]phosphite
[0066] Curing agent components:
[0067] Butyraldehyde aniline condensate 100 parts
[0068] The preparation process steps and conditions of the present embodiment are:
[0069] 1. 12 parts by weight of epoxy-modified acrylic resin, which is realized in Example 3 of CN201010297437.8, is dissolved with 45 parts of methyl methacrylate until it is completely transparent;
[0070] 2. Mix and stir 25 parts of chlorosulfonated polyethylene and 12 parts of methacrylic acid evenly, then add 2 parts of aluminum acetylacetonate, 0.4 par...
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