Laser safety protection method for laser processing device

A technology of laser processing and safety protection, applied in auxiliary devices, laser welding equipment, metal processing equipment, etc., can solve problems such as poor flexibility, safety protection loopholes, cumbersome processes, etc., and achieve the effect of easy construction and simple methods

Inactive Publication Date: 2016-05-04
UNIV OF SHANGHAI FOR SCI & TECH
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AI Technical Summary

Problems solved by technology

[0003] In the prior art, there are laser safety protection methods for laser processing devices, see the instructions and safe use specifications for laser processing devices of Italian PRIMA, Wuhan Jinyun, Wuhan Chutian, Wuhan Unity, Huagong Technology, Shenzhen Han’s and other companies, as well as the Chinese The national standard "Safety Requirements for Laser Processing Machinery" issued by the General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, standard number: GB/T18490-2001, these prior laser safety protection methods for laser processing devices have considerable advantages, but there are still some essential Insufficient: 1) The safety protection method is aimed at the use of the device and the various links in the use process to regulate the behavior of personnel. If the user does not follow the specifications or has misoperati

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  • Laser safety protection method for laser processing device

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with drawings and embodiments.

[0019] The laser safety protection method of the laser processing device of the present invention, such as figure 1 As shown, based on the principle of photoelectric detection, the optical fluorescent substance analysis technology and the photoelectric position detection technology are combined, and a weak light irradiation module and a photoelectric detection and analysis module are rigidly installed on the edge of the laser output machine of the laser processing head to realize the laser processing device. Laser safety protection.

[0020] The specific implementation steps of this embodiment are:

[0021] Step (1) Build the weak light irradiation module 3 and the photoelectric detection and analysis module 4, the weak light irradiation module 3 is composed of a detection light source 301 and an illumination optical component 302, and the illumination optical componen...

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Abstract

The invention relates to a laser safety protection method for a laser processing device. The laser safety protection method comprises the steps that 1, a weak light irradiation module and a photoelectric detection analysis module are constructed; 2, the weak light irradiation module and the photoelectric detection analysis module are rigidly installed on the laser emitting mechanical edge of a laser processing head, and emitting light of the weak light irradiation module irradiates the laser processing area and peripheral areas of the laser processing head; and 3, material information and movement position information of an optical interface inside the irradiated areas are detected by the photoelectric detection analysis module, whether a signal with vital signs in the areas exists or not is judged, and a laser output activity and a laser processing activity are stopped through hardware, so that laser safety protection of the laser processing device is achieved. The laser safety protection method for the laser processing device has the characteristics of being simple, convenient to construct, not limited by personnel factors, objective, reliable, free of potential safety hazards, high in intelligent degree, active in protection, high in response speed, modularization degree and flexibility, capable of expanding functions easily, wide in application range and the like.

Description

technical field [0001] The invention relates to a laser processing guarantee method, in particular to a laser safety guarantee method for a laser processing device, which is mainly used for laser welding, laser cutting, laser marking, laser drilling, laser heat treatment, laser forming, laser 3D printing, etc. Laser safety assurance for laser processing devices in the field. Background technique [0002] Laser processing usually uses high-power-density laser beams to irradiate workpieces to melt and gasify materials for special processing such as perforation, cutting and welding. Laser processing that uses laser thermal effects can be called laser thermal processing. Laser processing that uses light characteristics to change material properties can be called laser cold processing. According to specific processing actions, laser processing can be divided into laser welding, laser cutting, laser marking, laser drilling, laser heat treatment, laser forming, laser 3D printing, ...

Claims

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Application Information

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IPC IPC(8): B23K26/70B23K37/00
CPCB23K37/006
Inventor 詹秋芳张荣福高秀敏
Owner UNIV OF SHANGHAI FOR SCI & TECH
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