A kind of method of crushing pcb board
A PCB board and shredder technology, applied in recycling technology, mechanical material recycling, plastic recycling, etc., can solve the problems of environmental pollution, large loss of crushing machines, shortened service life, etc., and achieve high sorting recovery rate and machine loss Small size and high crushing efficiency
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Embodiment 1
[0018] The method for pulverizing PCB board of the present invention, comprises the following steps:
[0019] (1) Pulverization: Shear and pulverize the waste PCB board to 60-70mm in the pulverizer;
[0020] (2) Soaking: Soak the PCB board fragments crushed in step (1) in n-heptane for 5-10 minutes;
[0021] (3) Preheating: heat the PCB board fragments soaked in step (2) with an electric heater, and the temperature reaches 220°C;
[0022] (4) Pre-cooling: Refrigerate the PCB board fragments preheated in step (3) with a refrigerator, and the temperature is -15°C;
[0023] (5) Thermal shock: Thermally shock the PCB board fragments pre-cooled in step (4), the thermal shock time is controlled at 5-15s, the thermal shock temperature of the PCB board fragments rises from -20°C to 200°C, and the cooling Thermal temperature difference 220°C;
[0024] (6) secondary pulverization: the PCB board fragments after thermal shock in step (5) are carried out secondary pulverization with pul...
Embodiment 2
[0027] The method for pulverizing PCB board of the present invention, comprises the following steps:
[0028] (1) Pulverization: Shear and pulverize the waste PCB board to 60-70mm in the pulverizer;
[0029] (2) Soaking: Soak the PCB board fragments crushed in step (1) in n-heptane for 5-10 minutes;
[0030] (3) Preheating: heat the PCB board fragments soaked in step (2) with an electric heater to 240°C;
[0031] (4) Pre-cooling: Refrigerate the PCB board fragments preheated in step (3) with a refrigerator, and the temperature is -6°C;
[0032] (5) Thermal shock: Thermally shock the PCB board fragments pre-cooled in step (4), the thermal shock time is controlled at 5-15s, the thermal shock temperature of the PCB board fragments rises from -20°C to 250°C, and the cooling Thermal temperature difference 270°C;
[0033] (6) secondary pulverization: the PCB board fragments after thermal shock in step (5) are carried out secondary pulverization with pulverizer;
[0034] That is,...
Embodiment 3
[0036] The method for pulverizing PCB board of the present invention, comprises the following steps:
[0037] (1) Pulverization: Shear and pulverize the waste PCB board to 60-70mm in the pulverizer;
[0038] (2) Soaking: Soak the PCB board fragments crushed in step (1) in citric acid ester for 5-10 minutes;
[0039] (3) Preheating: heat the PCB board fragments soaked in step (2) with an electric heater to 200°C;
[0040] (4) Pre-cooling: Refrigerate the PCB board fragments preheated in step (3) with a refrigerator, and the temperature is -18°C;
[0041] (5) Thermal shock: Thermally shock the PCB board fragments pre-cooled in step (4), the thermal shock time is controlled at 5-15s, the thermal shock temperature of the PCB board fragments rises from -20°C to 280°C, and the cooling Thermal temperature difference 300°C;
[0042] (6) secondary pulverization: the PCB board fragments after thermal shock in step (5) are carried out secondary pulverization with pulverizer;
[0043]...
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