Electronic encapsulating material

Abstract

The invention provides an electronic encapsulating material which is composed of a basal body and a reinforcing body, wherein the basal body comprises an aluminum alloy; the reinforcing body is composed of graphene oxide and SiC particles; in terms of percentage by mass, the graphene oxide accounts for 0.5%-3%, SiC particles account for 35%-65%, and the balance being aluminum alloy powder; and the aluminum alloy powder is powder containing 55% of Al-Si, 15% of Al-Ti-B, 15% of Al-Be and 15% of Al. The electronic encapsulating material can be adopted to prepare a light electronic encapsulating with density being lower than 3.1g / cm<3> and thermal conductivity being greater than 180W / (m.K), so that the comprehensive performance of electronic equipment for military use is greatly improved, and therefore, the electronic encapsulating material is suitable for productive preparation of portable devices, power hybrid circuits for military use in the fields of aerospace and other weight sensitive fields, a carrier of a microwave tube, heat sink of a multi-chip assembly and super-high power module encapsulating materials.

Description

technical field [0001] The invention relates to an encapsulation material, in particular to an electronic encapsulation material with an aluminum alloy matrix, graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, thermodynamics, machinery and process equipme...

AI Technical Summary

Problems solved by technology

[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials

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