Welding method of SMD electrolytic capacitor

Abstract

The invention discloses a welding method of an SMD electrolytic capacitor. The welding method includes the following steps that: S1, a steel net is produced, the section of a pad opening of the steel net is T-shaped and is composed of a first rectangular portion and a second rectangular portion which are vertically communicated with each other; S2, solder printing is performed by adopting the steel net obtained in the step 1, and the pad opening is arranged in a manner that the pad opening is corresponding to the pad of the SMD electrolytic capacitor; S3, surface mounting is carried out: the SMD electrolytic capacitor is mounted on solder in a surface-mount manner; and S4, reflow soldering is carried out: the SMD electrolytic capacitor is welded on a printed circuit board. According to the method of the invention, the section of the pad opening of the steel net is designed to a T-shaped opening the size of which is smaller than that of the pad of the SMD electrolytic capacitor, and therefore, the area of the pad opening can be decreased, space can be reserved for the overflow of soldering tin, the probability of the overflow of the soldering tin can be reduced, welding points can be prevented from being short-circuited, welding yield can be improved, the consumption of the solder can be decreased, and surface-mounting cost can be decreased.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a welding method for patch electrolytic capacitors. Background technique [0002] The printed circuit board (Printed Circuit Board, referred to as PCB) is an important electronic component, a support for electronic components, and an electrical connection carrier for electronic components, and can realize automatic insertion or placement of electronic components, automatic soldering, automatic Testing ensures the quality of electronic equipment, improves labor productivity, reduces costs, and facilitates maintenance. [0003] With the development of the electronics industry, electronic products are becoming more and more miniaturized and integrated, and the PCB structure is also required to become more and more complex, so that the proportion of SMD components on the circuit board is increasing. Among them, SMD electrolytic capacitors are used...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that in the welding process of chip electrolytic capacitors in the prior art, the shape and size of the opening of the stencil are the same as that of the pad, and the solder melts during welding, and the capacitor easily causes the solder to overflow under the action of gravity, which is wasteful. It is easy to cause short circuit of solder joints, so a welding method for electrolytic capacitors that prevents solder overflow, avoids short circuit of solder joints and saves manufacturing cost is proposed

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