Production technology for single-sided PCB

A technology of PCB board and production process, applied in the field of production process of single-sided PCB board, can solve the problems of complicated production process and high production cost, and achieve the effect of ensuring appearance quality, good quality and high dimensional accuracy

Inactive Publication Date: 2016-05-11
湖北碧辰科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the production process of the existing single-sided PCB board is relatively complicated, and the production cost is relatively high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A production process for a single-sided PCB, comprising the following steps:

[0038] (1) Single-sided copper foil substrate pretreatment: Cut the single-sided copper foil substrate to the required size according to the layout diagram, and then perform surface pickling, surface grinding, water washing and baking on one side of the single-sided copper foil substrate in sequence Dry;

[0039] (2) Line coating exposure treatment: use an ink coating wheel to coat a photosensitive ink layer on the surface of the single-sided copper foil substrate, and perform a baking and drying treatment on the photosensitive ink layer, and finally perform drying on the dried single-sided copper foil substrate. Line film exposure processing;

[0040](3) Line development, etching, and ink removal treatment: place the single-sided copper foil substrate in a developing machine for development treatment, develop redundant lines, and place the single-sided copper foil substrate in an etching ma...

Embodiment 2

[0057] The difference between this embodiment and embodiment 1 is:

[0058] The acidic solution used in the pickling treatment in the step (1) and the step (5) is a sulfuric acid solution with a mass concentration of 4%; the surface grinding treatment in the step (1) and the step (5) uses a 500-mesh nylon mill Brush for scrubbing.

[0059] The thickness of the photosensitive ink layer in the step (2) is 9um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 125°C, and the baking speed is 5m / min; The thickness of the solder resist ink layer is 25um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 105°C, and the baking speed is 5m / min.

[0060] The exposure energy scale is controlled at 8 grids when the line film exposure treatment is performed in the step (2); the exposure energy scale is controlled at 9 grids when the solder resist film exposure treatment is performed in the step (5).

[0061] In the step ...

Embodiment 3

[0068] The difference between this embodiment and embodiment 1 is:

[0069] The acidic solution used in the pickling treatment in the step (1) and the step (5) is a sulfuric acid solution with a mass concentration of 5%; the surface scrubbing treatment in the step (1) and the step (5) uses a 500-mesh nylon mill Brush for scrubbing.

[0070] The thickness of the photosensitive ink layer in the step (2) is 11um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 125°C, and the baking speed is 5m / min; The thickness of the solder resist ink layer is 28um, the baking and drying equipment used is a tunnel furnace, the baking temperature is 105°C, and the baking speed is 5m / min.

[0071] The exposure energy scale is controlled at 8 grids when the circuit film exposure treatment is performed in the step (2); the exposure energy scale is controlled at 10 grids when the solder resist film exposure treatment is performed in the step (5).

[0072] The ma...

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Abstract

The invention relates to the technical field of PCBs, in particular to a production technology for a single-sided PCB. The technology sequentially comprises a single-sided copper foil substrate pretreatment step, a line coating and exposing treatment step, a line developing, etching and de-inking treatment step, a targeting hole treatment step, a solder resist pretreatment step, a solder resist developing step, a lettering treatment step, a molding treatment step, a testing step and an antioxidant treatment step. Surface polish-brush treatment is carried out on a copper foil substrate in a polish-brush manner; a photosensitive ink layer and a solder resist ink layer coat the surface of the copper foil substrate; relatively high adsorption capacity is provided among the photosensitive ink layer, the solder resist ink layer and the copper foil substrate; and the produced PCB is good in quality. A V-shaped board-dividing groove formed by cutting treatment on the copper foil substrate by a V-Cut process is free of a burr in subsequent board division. According to the production technology provided by the invention, targeting hole treatment is firstly carried out on the copper foil substrate; and then solder resist and baking treatment is carried out on the copper foil substrate, so that the dimensional accuracy of a targeting hole is high.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a production process of a single-sided PCB board. Background technique [0002] PCB board, also known as printed circuit board, printed circuit board, or printed board for short, uses an insulating board as the base material, cuts to a certain size, has at least one conductive pattern attached to it, and has holes (such as component holes, fastening holes, metallized holes, etc.), and realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called "printed" circuit boards. [0003] Single-sided PCB board is a very important type of PCB board in circuit boards. There are single-sided circuit board metal base PCB boards, Hi-Tg heavy copper foil circuit boards, flat winding single-sided circuit boards, and high-frequency PCB boards on the market. PCB, mixed dielectric base high-frequency single-sided circuit board...

Claims

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Application Information

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IPC IPC(8): H05K3/28H05K3/38
CPCH05K3/382H05K3/28H05K3/287H05K2203/0392
Inventor 刘诚胡锦程王福青
Owner 湖北碧辰科技股份有限公司
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