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Package structure for composite sensor module and manufacturing method of package structure

A composite sensor and packaging structure technology, applied in the field of sensors, can solve the problems of discrete device mounting and processing difficulties, high-density integration, and large module volume, and achieve the effects of shortening the development cycle, improving integration, and small size

Active Publication Date: 2016-05-25
GUANGDONG HEWEI INTEGRATED CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the premolding process and the production of lead frames require special molds, the cost is high and the development cycle is long; it is not suitable for small and medium batch production or small batch trial production in the R&D stage. In addition, when the TPMS system is updated, the sensor chip and IC control chip When the volume or appearance of discrete devices such as wireless communication chips and resistors and capacitors changes, it is necessary to remake the corresponding molds, which increases costs and causes waste
In addition, the lead frame is generally formed by metal stamping and has a large volume; it is difficult to mount and process discrete devices, and it is difficult to achieve high-density integration, resulting in a large packaged module

Method used

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  • Package structure for composite sensor module and manufacturing method of package structure
  • Package structure for composite sensor module and manufacturing method of package structure
  • Package structure for composite sensor module and manufacturing method of package structure

Examples

Experimental program
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Embodiment 1

[0046]In this embodiment, the packaging structure of a composite sensor module according to the present invention includes a substrate 1, on which there is a sensor chip mounting area surrounded by a number of discrete devices 5, and a sensor chip mounting area located on the sensor chip mounting area. In other chip mounting areas outside the area, a composite function sensor chip is installed in the sensor chip mounting area, and a plugging material 6 is arranged outside the discrete device 5, and the discrete device 5 and the plugging material 6 are jointly formed The dam structure 7 of the sensor chip installation area. The other chip mounting area is provided with a first protective material 8, the setting height of the first protective material 8 is the same as the height of the dam structure 7, and the sensor chip mounting area is provided with a protective composite function sensor chip and The second protective material 9 of the metal binding wire 13, the second protec...

Embodiment 2

[0066] Such as Figure 9 As shown, the technical solution of this embodiment is basically the same as that of Embodiment 1, the main difference is that the method of dispensing the silica gel used as the second protective material 9 in the above-mentioned manufacturing method is changed to prepare a layer of protective coating 11 to protect the TPMS sensor chip 4 and the metal bonding wire 13, the protective coating 11 is used without dripping silica gel, so that the height of the dam structure 7 can be reduced, and the volume and weight of the packaging structure can be further reduced.

[0067]Specifically, the protective coating 11 is prepared after the epoxy resin as the first protective material 8 is cured, and the material of the protective coating 11 is waterproof, moisture-proof, corrosion-resistant, stable, and high-temperature-resistant to protect the TPMS sensor chip 4 and the metal bonding wire 13, and ensure that the packaged TPMS sensor package module in the subs...

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Abstract

The invention discloses a package structure for a composite sensor module. The package structure comprises a substrate, wherein the substrate is provided with a sensor chip installation area and other chip installation areas, wherein the sensor chip installation area is enclosed by a plurality of discrete devices; the other chip installation areas are located outside the sensor chip installation area; a sensor chip is arranged in the sensor chip installation area; and the sensor chip is a complex function sensor chip and / or a separate function sensor chip. The invention further discloses a manufacturing method of the composite sensor module. The substrate is adopted by package of the composite sensor module instead of a lead frame; a sensor chip installation space is formed by the discrete device; and the composite sensor module with the structure is small in volume, good in consistency, low in cost and suitable for small or medium batch production.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a packaging structure of a composite sensor module and a manufacturing method thereof. Background technique [0002] The composite sensor module is to package the composite functional sensor chip and / or the single functional sensor chip in a module to realize the measurement of different physical quantities and realize the function of the module. The tire pressure monitoring (TPMS) sensor module is a typical composite sensor module, and the present invention uses the packaging of the TPMS sensor module as an example for illustration, but is not limited to the TPMS sensor module. [0003] Modern TPMS systems have higher and higher requirements on the size, function, and power consumption of devices, and devices need to be improved in various aspects to achieve more efficient integration. One of the main requirements is the miniaturization of the package to reduce the volume of th...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/492H01L23/06H01L21/98
CPCH01L2224/48091H01L2924/181H01L2924/00012H01L2924/00014H01L25/00H01L23/06H01L23/492H01L25/50
Inventor 许国辉邝国华朱二辉
Owner GUANGDONG HEWEI INTEGRATED CIRCUIT TECH
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