Package structure for composite sensor module and manufacturing method of package structure
A composite sensor and packaging structure technology, applied in the field of sensors, can solve the problems of discrete device mounting and processing difficulties, high-density integration, and large module volume, and achieve the effects of shortening the development cycle, improving integration, and small size
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[0045] Example one:
[0046] In this embodiment, the packaging structure of a composite sensor module according to the present invention includes a substrate 1 having a sensor chip mounting area surrounded by a number of discrete devices 5, and a sensor chip mounting area Other chip mounting areas outside the area, in which a composite functional sensor chip is mounted in the sensor chip mounting area, a plugging material 6 is provided outside the discrete device 5, and the discrete device 5 and the plugging material 6 are formed together The dam structure 7 of the sensor chip mounting area. The other chip mounting area is provided with a first protective material 8, and the height of the first protective material 8 is the same as the height of the dam structure 7, and the sensor chip mounting area is provided with a sensor chip for protecting composite function sensor chips and The second protection material 9 of the metal binding wire 13, the second protection material 9 is on...
Example Embodiment
[0065] Embodiment two:
[0066] Such as Picture 9 As shown, this embodiment is basically the same as the technical solution described in the first embodiment. The main difference is that the drop setting of the silica gel used as the second protective material 9 in the above manufacturing method is changed to prepare a protective coating 11 to protect the TPMS sensor chip 4 and the metal bonding wire 13, the protective coating 11 is used, and there is no need to drip silica gel, so that the height of the dam structure 7 can be reduced, and the volume and weight of the package structure can be further reduced.
[0067] Specifically, the protective coating 11 is prepared after the epoxy resin used as the first protective material 8 is cured. The protective coating 11 is made of materials that are waterproof, moisture-proof, corrosion-resistant, stable, and high-temperature resistant to protect the TPMS sensor chip 4 and the metal bonding wire 13, and ensure that the packaged TPMS s...
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