A kind of manufacturing method of laser brazing single-layer diamond grinding wheel
A single-layer diamond and manufacturing method technology, which is applied to welding media, manufacturing tools, welding equipment, etc., can solve the problems of reduced production efficiency, inability to use, and graphitization of diamond particles, and achieve the effects of reducing thermal damage and reducing costs
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Embodiment 1
[0020] (1) The matrix of the required diamond grinding wheel is prepared by machining, and 65Mn steel is selected as the matrix of the grinding wheel, and the matrix is degreased and derusted.
[0021] (2) Use NiCrBSi, CuPSn, TiH with a purity exceeding 99.9% by mass 2 , its mass percentage composition is: NiCrBSi is 20%; CuPSn is 75%; TiH 2 5%, mixed in proportion to make composite solder. The mass percentage of NiCrBSi alloy powder is composed of: C is 0.6-1.2%, Cr is 12-15%, B is 2.5-4.5%, Si is 3-4.5%, and Ni is 75-81%. The mass percentage of CuPSn is composed of: P is 5-6%, Sn is 2-3%, and Cu is 91-93%.
[0022] (3) Mix the composite solder and the pressure-sensitive adhesive at a weight ratio of 1:2.5 to make a solder slurry.
[0023] (4) Coating: The diamond particle size is 280-320 μm, and the solder slurry is evenly coated and fixed on the surface of the grinding wheel steel substrate. The thickness of the coated solder slurry is 100% of the average particle size...
Embodiment 2
[0028] (1) Prepare the substrate of the required diamond grinding wheel by machining, select 45 steel as the substrate of the grinding wheel, and degrease and derust the substrate.
[0029] (2) Use NiCrBSi, CuPSn, TiH with a purity exceeding 99.9% by mass 2 , its mass percentage composition is: NiCrBSi is 25%; CuPSn is 70%; TiH 2 5%, mixed in proportion to make composite solder. The mass percentage of NiCrBSi alloy powder is composed of: C is 0.6-1.2%, Cr is 12-15%, B is 2.5-4.5%, Si is 3-4.5%, and Ni is 75-81%. The mass percentage of CuPSn is composed of: P is 5-6%, Sn is 2-3%, and Cu is 91-93%.
[0030] (3) Mix the composite solder and the pressure-sensitive adhesive at a weight ratio of 1:2.6 to make a solder slurry.
[0031] (4) Coating: The diamond particle size is 120-150 μm, and the solder slurry is evenly coated and fixed on the surface of the grinding wheel steel substrate. The thickness of the coated solder slurry is 95% of the average particle size of the diamond...
Embodiment 3
[0036] (1) Prepare the substrate of the required diamond grinding wheel by machining, select 45 steel as the substrate of the grinding wheel, and degrease and derust the substrate.
[0037] (2) Use NiCrBSi, CuPSn, TiH with a purity exceeding 99.9% by mass 2 , and its mass percentage composition is: NiCrBSi is 18%; CuPSn is 80%; TiH 22%, mixed in proportion to make composite solder. The mass percentage of NiCrBSi alloy powder is composed of: C is 0.6-1.2%, Cr is 12-15%, B is 2.5-4.5%, Si is 3-4.5%, and Ni is 75-81%. The mass percentage of CuPSn is composed of: P is 5-6%, Sn is 2-3%, and Cu is 91-93%.
[0038] (3) Mix the composite solder and the pressure-sensitive adhesive at a weight ratio of 1:2.3 to make a solder slurry.
[0039] (4) Coating: The diamond particle size is 280-320 μm, and the solder slurry is evenly coated and fixed on the surface of the grinding wheel steel substrate. The thickness of the coated solder slurry is 95% of the average particle size of the diam...
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