Manufacturing method of sapphire crystal copper-clad lining plate and copper-clad lining plate thereof

A technology of sapphire crystal and manufacturing method, which is applied in the field of metallization of crystal substrates, can solve problems such as large dispersion of particles inside surface cavities, increased risk of electrical insulation failure, unfavorable module optical online monitoring, etc., to achieve good optical observation effect and heat dissipation Improved performance and tight adhesion

Active Publication Date: 2021-12-07
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The patent application number CN107546132 discloses that the double-layer brazing material enhances the bonding strength between the copper foil and the liner, reduces the electrical impedance, and has stronger withstand voltage and current resistance. Solve the hidden danger of electrical failure
The patent application number CN106169426 discloses that the bonding force between the titanium layer and the organic layer is enhanced, and the heat cycle resistance is high, but the increase in conductivity will reduce the insulation strength of the copper clad liner, the ability to withstand electrical breakdown will decrease, and the risk of electrical insulation failure will increase.
Both of the above two patents failed to fundamentally change the loose and porous structure of the liner, and the problems of surface voids and large dispersion of internal particles still exist, which are not conducive to the optical online monitoring of the module

Method used

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  • Manufacturing method of sapphire crystal copper-clad lining plate and copper-clad lining plate thereof
  • Manufacturing method of sapphire crystal copper-clad lining plate and copper-clad lining plate thereof
  • Manufacturing method of sapphire crystal copper-clad lining plate and copper-clad lining plate thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] refer to figure 2 According to the mass ratio of 99.9:0.1, the mixed powder of alumina and calcium carbonate was sprayed on the surface of the sapphire crystal substrate 1 of 30×30mm, and sintered at a high temperature of 1500° C. for 60 minutes to obtain the mixed powder adhesion layer 2 .

[0061] refer to image 3 , the active metal brazing material copper paste was printed on the surface of the mixed powder adhesion layer 2 of 30×30 mm, and dried at 100° C. for 5 minutes to obtain the active metal brazing material layer 3 .

[0062] Among them, the copper paste is prepared by mixing 84% copper nano powder, 5% plasticizer benzoate, 6% auxiliary diatomite clay and 5% organic solvent ether structure fatty acid ester.

[0063] refer to Figure 4 , soak the copper foil at 80°C with 10wt% sodium hydroxide solution for 20 minutes, wash it twice with distilled water; then soak it with 10wt% sulfuric acid solution at room temperature for 3 minutes, Wash twice and blow dr...

Embodiment 2

[0066] According to the mass ratio of 99.9:0.1, the mixed powder of alumina and calcium carbonate is sprayed on the surface of the sapphire crystal substrate of 30×30mm, and sintered at 1800°C for 40 minutes to obtain the mixed powder adhesion layer.

[0067] The active metal brazing material silver paste was printed on the surface of the 30×30 mm mixed powder adhesion layer, and dried at 80° C. for 15 minutes to obtain an active metal brazing material layer.

[0068] Among them, the silver paste uses 88% silver nano powder, 5% thickener-based acrylic acid, 4% plasticizer dipropylene glycol dibenzoate, diethylene glycol dibenzoate, 2% auxiliary agent methylol It is prepared by mixing acrylamide, ammonium bicarbonate, 1% organic solvent butyl carbitol acetate and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate.

[0069] Soak the copper foil in 10wt% sodium hydroxide solution at 80°C for 15 minutes and wash it twice with distilled water; then soak it in 10wt% sulfuric acid solut...

Embodiment 3

[0072] According to the mass ratio of 99.9:0.1, the mixed powder of alumina and calcium carbonate was sprayed on the surface of the sapphire crystal substrate of 30×30 mm, and sintered at 1600°C for 50 minutes to obtain the mixed powder adhesion layer.

[0073] The active metal brazing material calcium paste was printed on the surface of the 30×30 mm mixed powder adhesion layer, and dried at 90° C. for 12 minutes to obtain an active metal brazing material layer.

[0074] Among them, the calcium slurry is prepared by mixing 92% calcium nano powder, 3% thickener polyethylene glycol, silicon dioxide, 3% plasticizer tributyl citrate and 2% organic solvent dimethyl adipate. become.

[0075] Soak the copper foil in 10wt% sodium hydroxide solution for 18min at 80°C and wash it twice with distilled water; then soak it in 10wt% sulfuric acid solution at room temperature for 2min and wash it with distilled water Twice, blow dry. Place the treated copper foil on the surface of the acti...

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Abstract

The invention discloses a manufacturing method of a sapphire crystal copper-clad lining plate. The manufacturing method of comprises the following steps that aluminum oxide and calcium carbonate mixed powder coat on the surface of a sapphire crystal, and sintering is carried out to form a mixed powder adhesion layer; an active metal brazing material layer coats on the surface of the mixed powder adhesion layer; after copper foil is pretreated, the copper foil is sintered on the surface of the active metal brazing material layer to form a copper layer, and finally the sapphire crystal copper-clad lining plate is formed. The interior of the crystal of the sapphire crystal copper-clad lining plate is of a single-crystal structure, the particle contact area is large, and the heat dissipation performance is improved; the improved process realizes tight combination of the copper layer and the crystal, the peel strength is high, the surface voidage is low, and the electrical insulation property is excellent; and the light absorption intensity of the crystal is low, and optical online monitoring of a module chip can be realized.

Description

technical field [0001] The invention relates to the technical field of crystal substrate metallization, in particular to a method for manufacturing a sapphire crystal copper-clad lining board and the manufactured copper-clad lining board. Background technique [0002] In the production of power modules, semiconductor chips are generally installed on metallized composite liners with ceramic substrates, such ceramics mainly include nitride ceramic substrates such as AlN ceramics, oxide ceramic substrates such as Al 2 o 3 Ceramics, carbide ceramic substrates such as SiC ceramics, these ceramics use active metal brazing technology (AMB), that is, use brazing materials containing active metals such as Ti, Zr or Hf to heat and weld copper foil and ceramic substrates in a vacuum protection environment Together, the ceramic substrate and copper foil are bonded to each other. Specifically, the active metal in the ceramic substrate and the brazing material reacts chemically at the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/08B22F1/00
CPCC23C24/08
Inventor 李凯旋张博雅李兴文
Owner XI AN JIAOTONG UNIV
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