Manufacturing method of sapphire crystal copper-clad lining plate and copper-clad lining plate thereof

A technology of sapphire crystal and manufacturing method, which is applied in the field of metallization of crystal substrates, can solve problems such as large dispersion of particles inside surface cavities, increased risk of electrical insulation failure, unfavorable module optical online monitoring, etc., to achieve good optical observation effect and heat dissipation Improved performance and tight adhesion
CN113755832AActive Publication Date: 2021-12-07XI AN JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XI AN JIAOTONG UNIV
Publication Date
2021-12-07

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Abstract

The invention discloses a manufacturing method of a sapphire crystal copper-clad lining plate. The manufacturing method of comprises the following steps that aluminum oxide and calcium carbonate mixed powder coat on the surface of a sapphire crystal, and sintering is carried out to form a mixed powder adhesion layer; an active metal brazing material layer coats on the surface of the mixed powder adhesion layer; after copper foil is pretreated, the copper foil is sintered on the surface of the active metal brazing material layer to form a copper layer, and finally the sapphire crystal copper-clad lining plate is formed. The interior of the crystal of the sapphire crystal copper-clad lining plate is of a single-crystal structure, the particle contact area is large, and the heat dissipation performance is improved; the improved process realizes tight combination of the copper layer and the crystal, the peel strength is high, the surface voidage is low, and the electrical insulation property is excellent; and the light absorption intensity of the crystal is low, and optical online monitoring of a module chip can be realized.
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Description

technical field

[0001] The invention relates to the technical field of crystal substrate metallization, in particular to a method for manufacturing a sapphire crystal copper-clad lining board and the manufactured copper-clad lining board. Background technique

[0002] In the production of power modules, semiconductor chips are generally installed on metallized composite liners with ceramic substrates, such ceramics mainly include nitride ceramic substrates such as AlN ceramics, oxide ceramic substrates such as Al 2 o 3 Ceramics, carbide ceramic substrates such as SiC ceramics, these ceramics use active metal brazing technology (AMB), that is, use brazing materials containing active metals such as Ti, Zr or Hf to heat and weld copper foil and ceramic substrates in a vacuum protection environment Together, the ceramic substrate and copper foil are bonded to each other. Specifically, the active metal in the ceramic substrate and the brazing material reacts chemically at the e...

Claims

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