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Liquid Cold Plates for Electronic Component Cooling

A technology of electronic components and liquid cold plates, applied in the direction of cooling/ventilation/heating transformation, etc., can solve problems such as pressure drop and temperature rise, leakage points, fluid pressure drop increase, etc., to achieve temperature rise and cooling hydraulic pressure drop Effects of reduction, pressure drop reduction, and stroke reduction

Active Publication Date: 2018-04-13
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of using coiled tubes or plate fins to make flow passages (flow channels) is that: coiled tubes need to be bent from straight tubes, and a straight tube may only be made into a part of the coiled tube, so the coiled tube has Welding, there may be leaks
[0024] It can be seen from formula (3) that the temperature rise Δt of the cold plate is inversely proportional to the pressure drop ΔP, and in the heat exchanger equipment disclosed in ZL200580049517.9, the faster flow rate of the coolant in the high heat flux area will lead to an increase in the pressure drop of the fluid
Its optimization measures cannot take into account the pressure drop and temperature rise

Method used

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  • Liquid Cold Plates for Electronic Component Cooling
  • Liquid Cold Plates for Electronic Component Cooling
  • Liquid Cold Plates for Electronic Component Cooling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] like figure 1 and figure 2As shown, the liquid cold plate used for cooling electronic components includes a base plate 1 and a cover plate. The base plate 1 is provided with a plurality of parallel straight grooves 11, and the front and rear adjacent straight grooves 11 are connected end to end, and the straight grooves 11 pass through The connecting groove 12 is connected, and there is a circular arc transition between the straight groove 11 and the connecting groove 12; the straight groove 11 on the base plate 1, the connecting groove 12 and the cover plate enclose a flow channel for the cooling liquid to flow through, and the bottom of each straight groove 11 A bottom groove 13 is opened on the wall, and the width of the bottom groove 13 accounts for 60%-80% of the width of the flow channel. The flow channel is topped by the cover plate and bottomed by the base plate 1 , and the wall surface of the straight groove 11 closed by the cover plate is the top wall of the...

Embodiment 2

[0076] The difference between this embodiment and Embodiment 1 is that the flow channel has two inlets I1, I2, and one outlet E, and the outlet E is located between the two inlets I1, I2, as Figure 17 shown. The flow channel is set as two inlets I1 and I2, and the coolant enters into the two inlets I1 and I2 respectively, so that the coolant only needs to flow from any inlet to the outlet, without completely flowing through the entire flow channel, the cooling liquid The pressure drop is greatly reduced.

[0077] Outlet E is located at 1 / 2 of the runner stroke. The stroke of the coolant from the inlets I1 and I2 to the outlet E is 1 / 2 of the length of the flow channel, so the distance traveled by the coolant in the cold plate is reduced by half, and the pressure drop of the coolant is greatly reduced.

[0078] Figure 18 and Figure 19 In the simulation, there are no grooves in the flow channel, but only the pressure drop and temperature simulation cloud images with diffe...

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PUM

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Abstract

A liquid cold plate used for cooling electronic components, including a base plate and a cover plate. There are multiple parallel straight slots on the base plate, and the adjacent straight slots are connected end to end. The arc transition between the grooves; the straight grooves on the base plate, the connecting grooves and the cover plate form a flow channel for the cooling liquid to flow through, and a first groove is opened on the bottom wall of each straight groove, and the width of the first groove is It accounts for 60% to 80% of the width of the runner. The invention has the advantages of being able to take into account both the temperature rise of the liquid cold plate and the drop of cooling hydraulic pressure, and realize the simultaneous and substantial reduction of the temperature rise of the liquid cold plate and the drop of cooling hydraulic pressure.

Description

technical field [0001] The invention relates to a heat exchanger device suitable for being installed on electronic equipment and a generator, in particular to a liquid cold plate. technical background [0002] The liquid cold plate has excellent heat dissipation performance. It is a device with medium and high power density. The liquid cold plate can effectively take away the heat dissipation in power devices, printed circuit board assemblies or extension equipment. The characteristics of the liquid cold plate cooling system are: (1) the temperature gradient on the cold plate is small, the heat distribution is uniform, and the large concentrated heat load can be taken away; (2) due to the indirect cooling method, the electronic components can not Direct contact with coolant reduces various pollution and improves work reliability; (3) Compared with direct cooling, the loss of coolant is less, and it is also convenient to use more effective coolant to improve cooling efficienc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 曹衍龙唐树莺杨将新高振波鄢慧文刘述文陈雷
Owner ZHEJIANG UNIV
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