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Formula for copper plating solution and process

A process method and technology of copper plating solution, applied in the field of copper plating process on metal surface, can solve the problems of poor coating adhesion, large crystal structure of coating, low surface brightness, etc., and achieve good adhesion of coating, fine crystal structure of coating, and pores. low rate effect

Inactive Publication Date: 2016-06-29
CHONGQING LINGYI MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are defects such as low surface brightness, large crystallization of the coating structure, not uniform enough, poor bonding ability of the coating, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Embodiment 1: a kind of copper plating solution formula and process method, described formula is by 52g / L basic copper carbonate, 280g / L citric acid, 33g / L sodium tartrate, 1.62g / L sodium bicarbonate, 0.021 g / L brightener, pH value is 8.5, temperature is 38°C, current density is 1.5A / dm2, cathode and anode area ratio is 1:2, plating time is 9min, dispersion ability of plating solution is 82%, coverage ability of plating solution is 5.

Embodiment 2

[0009] Embodiment 2: a kind of copper plating solution formula and processing method, described formula is by 54g / L basic copper carbonate, 260g / L citric acid, 32g / L sodium carbonate of tartrate, 2g / L sodium bicarbonate, 0.022g / L brightener, pH value is 8.5, temperature is 36°C, current density is 1.5A / dm2, cathode and anode area ratio is 1:2, plating time is 9min, plating solution dispersibility is 84%, plating solution coverage is 5.

[0010] According to the copper plating liquid formula and process method of the present invention, the surface brightness of the plated layer obtained by the process is above grade two, the porosity is low, the crystallization of the plated layer is fine and uniform, and the bonding ability of the plated layer is good.

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PUM

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Abstract

The invention discloses a formula for a copper plating solution and a process. The invention is characterized in that the formula is composed of 50 to 55 g / L of basic copper carbonate, 250 to 300 g / L of citric acid, 30 to 35 g / L of sodium tartarate, 1.5 to 2 g / L of sodium bicarbonate and 0.02 to 0.025 g / L of a brightener and has a pH value of 8.0 to 9.0; temperature is 35 to 40 DEG C; current density is 1.5 A / dm<2>; the area ratio of a negative electrode to a positive electrode is 1: 2; plating time is 8 to 10 min; and the copper plating solution has covering power of 80 to 85% and covering power of 4.5 to 6. With the formula for the copper plating solution and the process in the invention, a plated layer obtained in the invention has surface brightness improved to a grade above two, low porosity, fine and uniform structure crystals and good bonding capability.

Description

technical field [0001] The invention belongs to the technical field of copper plating on metal surfaces, in particular to a copper plating liquid formula and a process method. Background technique [0002] Cyanide copper plating is the earliest and most widely used copper plating process. The plating solution is mainly composed of copper cyanide complex and a certain amount of free cyanide, which is strongly alkaline. Because cyanide has a strong activation and complexing ability, the first feature of this electroplating method is that the solution has a certain degreasing and activation ability. Secondly, because this plating solution uses cyanide with strong complexing ability, the complex ion is not easy to discharge, so the cathodic polarization of the bath is very high, and it has excellent throwing ability and covering ability. However, there are defects such as low surface brightness, large crystallization of the coating structure, not uniform enough, and poor bondi...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 张刚
Owner CHONGQING LINGYI MACHINERY CO LTD
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