Connection method for heat-conducting wire and metal substrate

A technology of metal substrates and heat conducting wires, applied in metal processing equipment, metal material coating technology, welding media, etc., can solve the problems of being unable to withstand too much bending stress, reduce energy consumption, improve connection strength and life, and save the effect of using

Active Publication Date: 2016-07-06
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is a general T-shaped welding joint, the solder is attached to the outer surface of the thermal wire and cannot bear too much bending stress

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The heat conduction wire used in this embodiment is carbon fiber material with a diameter of 100um, and a bundle of 50 carbon fibers is gathered; the coating 2 is a SiC coating with a thickness of 0.01mm, and the metal substrate is a length of 10cm, a width of 8cm, and a thickness of 0.5mm. cm stainless steel plate.

[0036] A method for realizing the connection of the heat conduction wire and the metal substrate comprises the following steps:

[0037](1) First use sandpaper to polish one end of the heat conduction wire connected to the metal substrate, clean the heat conduction wire with anhydrous ethanol in an ultrasonic wave, and then dry it at 120°C. In terms of mass percentage, mix 85% silicon powder, 5% carbon powder and 10% trialuminum dioxide to prepare the initial embedding material, and use a ball mill to mill it for 2 hours, and mix evenly to obtain the embedding material; The material is used to embed one end of the heat conduction wire connected to the met...

Embodiment 2

[0049] The thermal conductive wire used is carbon fiber material with a diameter of 50um, and a bundle of 100 carbon fibers is gathered; the coating is a metal coating with a thickness of 0.02mm, and the metal substrate is a copper plate with a length of 10cm, a width of 10cm, and a thickness of 1cm.

[0050] A method for realizing the connection of the heat conduction wire and the metal substrate comprises the following steps:

[0051] (1) Use sandpaper to polish one end of the heat conduction wire connected to the metal substrate first, clean the heat conduction wire with anhydrous ethanol in ultrasonic waves, and then dry the heat conduction wire at 120°C). Heated at 350°C and oxidized in air for 30min.

[0052] The JGP450 ultra-high vacuum multi-target magnetron sputtering system is used to plate metal copper coating on the carbon fiber surface. The main metal target is Cu, the sputtering pressure is 1.0Pa, the time is 10min, and the power is 20W. Attach a 0.02 mm metal c...

Embodiment 3

[0065] The heat conduction wire used in this embodiment is carbon fiber material with a diameter of 100um, and a bundle of 50 carbon fibers is gathered; the coating 2 is a SiC coating with a thickness of 0.01mm, and the metal substrate is a length of 8cm, a width of 8cm, and a thickness of 0.5mm. cm aluminum plate.

[0066] A method for connecting a heat conduction wire to a metal substrate, comprising the following steps:

[0067] (1) First use sandpaper to polish one end of the heat conduction wire connected to the metal substrate, clean the heat conduction wire with anhydrous ethanol in an ultrasonic wave, and then dry it at 120°C. In terms of mass percentage, mix 85% silicon powder, 5% carbon powder and 10% trialuminum dioxide to prepare the initial embedding material, and use a ball mill to mill it for 2 hours, and mix evenly to obtain the embedding material; The material is used to embed one end of the heat conduction wire connected to the metal substrate. The temperatu...

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Abstract

The invention discloses a connection method for a heat-conducting wire and a metal substrate. By the adoption of the connection method, the problems that the heat-conducting wire is not matched with metal due to heat expansion, so that cracks are generated easily, and consequentially a connector fails and the wettability between molten liquid and the heat-conducting wire is poor are solved. The connection method comprises the steps that the end, to be connected, of the heat-conducting wire is cleaned, and surface coating treatment is conducted on one end of the heat-conducting wire, so that the end of the heat-conducting wire is coated with a coating with the thickness being 0.01 mm-1 mm; solder paste containing expansion particles is fully smeared on the end, to be connected, of the heat-conducting wire, and the heat-conducting wire is placed into a groove, with the diameter being 5 mm-8 mm, in the metal substrate after the solder paste containing the expansion particles is solidified; heating is conducted till the solder paste of the end, to be connected, of the heat-conducting wire is fully molten, and heat preservation is conducted; and cooling is conducted till the indoor temperature is reached. According to the connection method for the heat-conducting wire and the metal substrate, the expansion particles are added into the solder paste so that the size of solder in the molten state can be expanded rapidly, and accordingly air is exhausted, seams in the groove are filled with the solder, seamless connection between the heat-conducting wire and the metal substrate is achieved, and the efficient heat conductivity of the heat-conducting wire can be brought into full play easily.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a method for realizing the connection between a heat conducting wire and a metal substrate. Background technique [0002] With the development of science and technology, the traditional heat dissipation technology is difficult to meet the heat dissipation per unit area of ​​the increasing electronic components, and the traditional heat dissipation technology is also difficult to meet the heat dissipation requirements of moving parts, so people urgently need a flexible heat conduction material with high thermal conductivity To meet the requirements of heat conduction and easy thermal management design at the same time. Carbon materials have high theoretical thermal conductivity, and can be designed to produce directional and high thermal conductivity materials, and carbon materials can be made into flexible materials by compounding with other materials. Therefore, carbon materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/002B23K1/20B23K35/40C23C12/02
CPCB23K1/0008B23K1/002B23K1/20B23K1/206B23K35/40C23C12/02
Inventor 李静吴少如樊春雷
Owner SOUTH CHINA UNIV OF TECH
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