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Lead-free low-softening point acid-resistant glass powder for chip component paste and preparation method

A technology of glass powder and components, which is applied in the field of lead-free low-melting acid-resistant glass powder for chip component paste and its preparation. It can solve the problems that glass powder cannot meet the requirements of chip components and low softening point, and achieve excellent chemical The effects of stability, no pores and cracks, and dense film surface

Inactive Publication Date: 2016-07-06
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a lead-free low-melting point acid-resistant glass powder for chip component paste and a preparation method. The glass powder is lead-free, low softening point and acid-resistant, so as to solve the problem that the glass powder in the prior art is difficult to meet the needs of chip components. Questions about usage requirements

Method used

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preparation example Construction

[0041] The embodiment of the present invention also provides a preparation method of lead-free low-melting acid-resistant glass powder for chip component paste, comprising the following steps:

[0042] Weigh each raw material and fully mix to make a mixture;

[0043] Heat the mixture at 1000°C to 1300°C for 30 to 40 minutes to fully melt the mixture into molten glass;

[0044] Pressing or quenching the melted molten glass to form flake or granular glass blocks;

[0045] The glass blocks are ball-milled, then dried and sieved to obtain glass powder.

[0046] Wherein, in the above-mentioned step of weighing raw materials, according to mass percentage, the raw materials include the following components:

[0047] 30-70% Bi 2 o 3 , 20-45% SiO 2 , 1~10% of B 2 o 3 , 0~5% Al 2 o 3 , 0~15% ZnO, 0~5% CaO, 0~10% TiO 2 , 0~5% ZrO 2 , and a total amount of 1 to 10% selected from Na 2 O, K 2 O, or Li 2 One or more alkali metal oxides in O.

[0048] Further, according to mass...

Embodiment 1

[0053] (1) Weigh each raw material and fully mix to make a mixture, wherein, in terms of mass percentage, the raw material includes the following components: 25% SiO 2 , 4% B 2 o 3 , 56% Bi 2 o 3 , 1% Al 2 o 3 , 8% ZnO, 4% TiO 2 , 2% Na 2 O.

[0054] (2) Put the above mixture into a crucible, and keep it in an electric furnace with a furnace temperature of 1300° C. for 30 minutes to fully melt the mixture into molten glass.

[0055] (3) Pour the melted glass liquid into a tablet press for tableting or pour it into cold water for quenching to form flake or granular glass blocks.

[0056] (4) Put the above-mentioned glass blocks into a ball mill, a vibration ball mill or a planetary ball mill for ball milling, then dry and sieve to obtain glass powder.

[0057] The glass powder prepared in embodiment one is tested, and the test result of this glass powder is as follows:

[0058] Expansion coefficient: 80×10 -7 / °C;

[0059] Softening point: 460°C.

[0060] The elect...

Embodiment 2

[0065] (1) Weigh each raw material and fully mix to make a mixture, wherein, in terms of mass percentage, the raw material includes the following components: 32% SiO 2 , 3% B 2 o 3 , 50% Bi 2 o 3 , 1% Al 2 o 3 , 6% ZnO, 2% TiO 2 , 2% Na 2 O, 4% K 2 O.

[0066] (2) Put the above mixture into a crucible, and keep it in an electric furnace with a furnace temperature of 1250° C. for 30 minutes to fully melt the mixture into molten glass.

[0067] (3) Pour the melted glass liquid into a tablet press for tableting or pour it into cold water for quenching to form flake or granular glass blocks.

[0068] (4) Put the above-mentioned glass blocks into a ball mill, a vibration ball mill or a planetary ball mill for ball milling, then dry and sieve to obtain glass powder.

[0069] The glass powder prepared in embodiment two is tested, and the test result of this glass powder is as follows:

[0070] Expansion coefficient: 80×10 -7 / °C;

[0071] Softening point: 476°C.

[0072...

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Abstract

The invention provides a lead-free low softening point acid-resistant glass powder for chip component paste and a preparation method thereof. The glass powder comprises the following components in terms of mass percentage: 30-70% Bi 2 o 3 , 20-45% SiO 2 , 1~10% of B 2 o 3 , 0~5% Al 2 o 3 , 0~15% ZnO, 0~5% CaO, 0~10% TiO 2 , 0~5% ZrO 2 , and a total amount of 1 to 10% selected from Na 2 O, K 2 O, or Li 2 One or more alkali metal oxides in O. This kind of glass powder is lead-free, low softening point and acid-resistant, especially suitable for electronic paste of chip components.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a lead-free low-melting-point acid-resistant glass powder for chip element slurry and a preparation method thereof. Background technique [0002] Electronic paste is an industrial raw material mainly used for making various electronic components. It is composed of a variety of raw materials, and then rolled to form a paste-like fluid with certain viscosity characteristics. For glass frits that can be used in electronic pastes, the performance requirements are usually high, so as to meet the preparation requirements of various electronic components. For example, it is generally required to have appropriate resistivity, low dielectric constant and low dielectric loss, thermal shock resistance, environmental stability and other characteristics. Due to the particularity of its preparation process, some electronic components have a strong influence on the glass frit in the...

Claims

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Application Information

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IPC IPC(8): C03C12/00C03C8/24
CPCC03C12/00C03C8/24
Inventor 孙社稷陆冬梅王要东王大林赵科良雷莉君梅元
Owner 西安宏星电子浆料科技股份有限公司
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