Method for preparing thermally conductive composite material with directivity

A heat-conducting composite material and directional technology, which is applied in the field of preparation of directional heat-conducting composite materials, can solve problems such as poor thermal conductivity, and achieve the effects of simple operation, expanded application fields, and short preparation cycle

Inactive Publication Date: 2016-07-20
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Most polymer materials have good electrical insulation, cold resistance, high air permeability, and chemical stability, and are widely used in electronic components and integrated assembly; but their thermal conductivity is very poor, and the general thermal conductivity does not exceed 0.5W / m.K

Method used

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  • Method for preparing thermally conductive composite material with directivity
  • Method for preparing thermally conductive composite material with directivity
  • Method for preparing thermally conductive composite material with directivity

Examples

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Effect test

Embodiment 1

[0025] see figure 1 , in an embodiment of the present invention, a method for preparing a directional thermally conductive composite material, the specific steps are as follows:

[0026] (1) Surface treatment of carbon nanotubes: Mix the surfactant and deionized water at a weight ratio of 0.1:10 to obtain an aqueous solution of the surfactant, stir evenly, then add 1 mg of carbon nanotubes, and perform ultrasonic dispersion at room temperature 0.5h, to obtain carbon nanotube suspension, 3000r / min centrifugation for 2min, wash 3 times with deionized water, then wash 2 times with absolute ethanol, dry at 60°C in a vacuum oven for 10h, to obtain surface-treated carbon nanotube;

[0027] (2) Dissolve 0.1wt% of the surface-treated carbon nanotubes obtained in step (1) in 5 parts of dispersant, ultrasonically disperse for 20 minutes, then add 10 parts of silicone rubber matrix, perform mechanical uniform stirring for 10 minutes, and ultrasonically disperse again until The dispersa...

Embodiment 2

[0029] A method for preparing a directional thermally conductive composite material, the specific steps are as follows:

[0030] (1) Surface treatment of carbon nanotubes: Mix the surfactant and deionized water at a weight ratio of 2:10 to obtain an aqueous solution of the surfactant, stir evenly, then add 6 mg of carbon nanotubes, and perform ultrasonic dispersion at room temperature After 0.8h, the carbon nanotube suspension was obtained, centrifuged at 3500r / min for 3min, washed 4 times with deionized water, and then washed 3 times with absolute ethanol, and dried in a vacuum oven at 65°C for 17h to obtain surface-treated carbon nanotubes. nanotube;

[0031] (2) Dissolve 0.5wt% of the surface-treated carbon nanotubes obtained in step (1) in 8 parts of dispersant, ultrasonically disperse for 25 minutes, then add 10 parts of silicone rubber matrix, perform mechanical uniform stirring for 20 minutes, and ultrasonically disperse again until The dispersant is completely volatil...

Embodiment 3

[0034] A method for preparing a directional thermally conductive composite material, the specific steps are as follows:

[0035] (1) Surface treatment of carbon nanotubes: Mix the surfactant and deionized water at a weight ratio of 3:10 to obtain an aqueous solution of the surfactant, stir evenly, then add 10 mg of carbon nanotubes, and perform ultrasonic dispersion at room temperature 1h, get carbon nanotube suspension, centrifuge at 4000r / min for 5min, wash 5 times with deionized water, then wash 4 times with absolute ethanol, dry in vacuum oven at 70°C for 24h, get surface-treated carbon nanotubes Tube;

[0036] (2) Dissolve 1wt% of the surface-treated carbon nanotubes obtained in step (1) in 10 parts of dispersant, ultrasonically disperse for 30 minutes, then add 10 parts of silicone rubber matrix, perform mechanical uniform stirring for 30 minutes, and ultrasonically disperse again until dispersed The agent is completely volatilized, vacuumed to remove air bubbles, poure...

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Abstract

The invention discloses a method for preparing a thermally conductive composite material with directivity in order to solve the heat dissipation problem of conventional materials and traditional technology electronic components. The method comprises the following steps that: a carbon material accounting for 0.1 to 15wt% of a thermally conductive silicone rubber composite material forms an anisotropic thermally conductive path in a polymer matrix under the action of a strong magnetic field, and the thermally conductive composite material mainly comprises a thermally conductive carbon filler of carbon nanotubes or graphenes or a mixture thereof and a silicone rubber matrix; the carbon material is ultrasonically dispersed and poured into a mold to be molded by curing under the action of the strong magnetic field, so that the carbon nanotubes or graphenes form chain structures to be arranged in the matrix, thus generating the thermally conductive composite material with directivity. The method provided by the invention has the advantages of simple and safe operation and short preparation period, the carbon material without a magnetic function is regularly arranged in structure under the action of the strong magnetic field to form an anisotropic composite material, and the thermal conduction has directivity.

Description

technical field [0001] The invention relates to the field of heat-conducting polymer composite materials, in particular to a method for preparing a directional heat-conducting composite material. Background technique [0002] In recent years, with the development of modern industry, information industry and high-tech, especially with the continuous improvement of the integration level and assembly density of microelectronic components, the heat dissipation of heating elements has become a prominent problem. According to reports, when the temperature increases by 2°C, the reliability of electronic components will decrease by 10%; and when the temperature increases by 50°C, the life of electronic components will be shortened by 5 times compared with that when the temperature increases by 25°C. In order to ensure the stable and reliable operation of electronic components for a long time, the working temperature must be effectively controlled. At present, conventional materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08K9/06C08K7/24
CPCC08K9/06C08K7/24C08K2201/004C08K2201/011C08L83/04
Inventor 李彬王晓杰董帅张雅堃王容川
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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