Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Three-layer co-extrusion high-temperature-resistant glue blocking release film and production process thereof

A high-temperature release film, three-layer co-extrusion technology, applied in layered products, synthetic resin layered products, chemical instruments and methods, etc., can solve problems such as silicone oil precipitation, contamination of circuit boards, etc. The effect of good fluidity and good chemical stability

Active Publication Date: 2016-08-10
久裕电子科技(江苏)有限公司
View PDF7 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, related products cannot meet the above requirements at the same time, and must be used together
There are also some products that are evenly coated with a very thin layer of silicone release agent on the surface, and silicone oil will be precipitated during use, contaminating the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-layer co-extrusion high-temperature-resistant glue blocking release film and production process thereof
  • Three-layer co-extrusion high-temperature-resistant glue blocking release film and production process thereof
  • Three-layer co-extrusion high-temperature-resistant glue blocking release film and production process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1: as figure 1As shown, a three-layer co-extruded high temperature resistant adhesive release film, the mass fraction of each component in the outer film is as follows: PBT polybutylene terephthalate 49%, PA66 polyamide resin 26%, AX8900 resin 5% and glass fiber reinforced plastics 20%; the mass fraction of each component in the resist filling film is as follows: PBT polybutylene terephthalate 68%, EVA ethylene-vinyl acetate copolymer 16%, LDPE low density polyethylene Ethylene 11%, AX8900 resin 3% and stabilizer 2%; In the high-temperature release film of the present invention, the thickness of the release upper layer film and the release type lower layer film is 30% of the total thickness of the release film, and the thickness of the resist filling film The thickness is 40% of the total thickness of the release film.

Embodiment 2

[0036] Embodiment 2: as figure 1 As shown, a three-layer co-extruded high temperature resistant adhesive release film, the mass fraction of each component in the outer film is as follows: PBT polybutylene terephthalate 51%, PA66 polyamide resin 24%, AX8900 resin 5% and glass fiber reinforced plastics 20%; the mass fraction of each component in the resist filling film is as follows: PBT polybutylene terephthalate 72%, EVA ethylene-vinyl acetate copolymer 14%, LDPE low density polyethylene Ethylene 9%, AX8900 resin 3% and stabilizer 2%; In the high-temperature release film of the present invention, the thickness of the release upper film and the release lower film are 30% of the total thickness of the release film, and the thickness of the resist filling film The thickness is 40% of the total thickness of the release film.

Embodiment 3

[0037] Embodiment 3: as figure 1 As shown, a three-layer co-extruded high temperature resistant adhesive release film, the mass fraction of each component in the outer film is as follows: PBT polybutylene terephthalate 50%, PA66 polyamide resin 25%, AX8900 resin 5% and glass fiber reinforced plastics 20%; the mass fraction of each component in the resist filling film is as follows: PBT polybutylene terephthalate 70%, EVA ethylene-vinyl acetate copolymer 15%, LDPE low density polyethylene Ethylene 10%, AX8900 resin 3% and stabilizer 2%; In the high-temperature release film of the present invention, the thickness of the release upper layer film and the release type lower layer film is 30% of the total thickness of the release film, and the thickness of the resist filling film The thickness is 40% of the total thickness of the release film.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
lengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a three-layer co-extrusion high-temperature-resistant glue blocking release film and a production process thereof. The glue blocking release film is formed by combining two outer film bodies and a glue blocking filling film body, the outer film bodies comprise an upper release film body and a lower release film body, and the glue blocking filling film body is arranged between the upper release film body and the lower release film body. Each outer film body is prepared from, by mass, 49-51% of polybutylece terephthalate (PBT), 24-26% of polyamide resin PA66, 5% of compatilizer and 20% of glassfiber reinforced plastics. The glue blocking filling film body is prepared from, by mass, 68-72% of polybutylece terephthalate (PBT), 14-16% of EVA-vinyl acetate copolymer, 9-11% of LDPE low-density polyethylene, 3% of compatilizer and 2% of stabilizer. The thickness of the upper release film body and the thickness of the lower release film body in the high-temperature-resistant release film each account for 30% of the total thickness of the release film. While high temperature resistance of the release film is ensured, the glue blocking performance is improved, the glue output length is 0.9 mm, and the qualification rate of a flexible printed circuit (FPC) can be increased effectively.

Description

technical field [0001] The invention relates to the field of auxiliary equipment for the production of flexible circuit boards, in particular to a three-layer co-extruded high-temperature-resistant, adhesive-resisting release film and a production process for the production of flexible circuit boards. Background technique [0002] Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. Referred to as soft board or FPC, it has the characteristics of high wiring density, light weight, and thin thickness. It is mainly used in many products such as mobile phones, notebook computers, PDAs, digital cameras, and LCMs. [0003] In the lamination of FPC flexible circuit boards, the release film determines the quality of lamination, and lamination is also the most important process of FPC board factory. Therefore, the selection of the release film is very important. The release film us...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/02C08L77/06C08L23/08C08L23/06C08K7/14B32B27/08B32B27/36B32B27/18B29C47/00
CPCB29C48/0013B29C48/0018B32B27/08B32B27/18B32B27/36C08J5/18C08J2367/02C08J2423/08C08J2477/06C08L67/02C08L2201/08C08L2203/16C08L2203/20C08L2205/03C08L2205/035C08L2207/066C08L77/06C08L23/0884C08K7/14C08L23/0853C08L23/06
Inventor 牛军强詹浩周学军陈百怀
Owner 久裕电子科技(江苏)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com