Liquid metal printing device

Abstract

The invention discloses a liquid metal printing device. The device comprises a liquid metal printing mechanism, a substrate movement mechanism connected with the liquid metal printing mechanism, a voltage pulse regulating and controlling mechanism connected with the liquid metal printing mechanism and the substrate movement mechanism, and a control device connected with the liquid metal printing mechanism, the substrate movement mechanism and the voltage pulse regulating and controlling mechanism. The liquid metal printing device is used for liquid metal ink which is low in viscosity and high in surface tension, and not only are the printing precision of liquid metal patterns and wettability between liquid metal and a base improved, but also plane printing and space 3D printing can be achieved.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuits and printed electronic devices, in particular to a liquid metal printing device. Background technique [0002] A key factor restricting the development of printed electronics technology is the development of printed electronic materials. Traditional conductive inks include carbon-based conductive materials, conductive polymers and metal nanomaterials. Liquid metal has both metallic and fluid properties. Low-melting-point alloys below 300°C can be configured as electronic ink. Compared with other conductive inks, liquid metal ink has lower cost, stable physical and chemical properties, relatively high conductivity, and the formation of conductive lines does not require post-processing. [0003] Different from the etching processing method adopted by traditional printed circuits, liquid metal ink can directly and quickly produce circuits through microchannel method, mask method, impri...

AI Technical Summary

Problems solved by technology

However, since liquid metal ink is a fluid with low viscosity and high surface tension, no matter what kind of existing methods there are certain problems in terms of printing accuracy, liquid metal and substrate wettability, etc.

For example, the microchannel method is not suitable for complex circuits, and due to the high surface tension, a large injection pressure needs to be applied when injecting liquid metal into the microchannel, which determines the limited precision of the circuit printed by the microchannel method; Like the microfluidic method, the film method needs to make a mold, which is time-consuming and laborious, and the produced pattern often has problems such as blurred edges and disconnected lines; the pattern produced by the imprinting method has limited precision and uneven line height; Slow, and there is also the problem of limited pattern accuracy; the existing liquid metal 3D printing method uses microsphere deposition method, the speed is very slow, and the pattern accuracy is very low; the direct writing method does not need to make a template, CN104118222A proposes a liquid metal The metal needle type printing equipment and printing method realize the quick printing of the circuit through the direct writing method, but because the surface tension of the printed liquid metal ink does not change much, the accuracy of the circuit is limited, and when the pinhole diameter is reduced, the liquid metal ink is easy to block the pen head , cannot print sub-micron size patterns, and the device is not suitable for printing 3D patterns

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