Preparation method of planeness-self-compensating multi-tip array for large area micromachining

Abstract

The invention discloses a preparation method of planeness-self-compensating multi-tip array for large area micromachining, comprising the following steps: plating a layer of wax sheet film (3) on a glass slide (4), and forming uniformly arranged grooves (2) on the wax sheet film (3); adding microspheres (6) into each groove (2) one by one, further pressing the microspheres (6) into the wax sheet film through a slide (7) to make all the microspheres (6) contact the glass slide (4); adhering an elastic material sheet (10) on a flat tip plate (8), and further applying a layer of UV gel (11); flat pressing the UV gel of the tip plate (8) on the microspheres (6), simultaneously carrying out ultraviolet radiation on the UV gel, thereby solidifying the UV gel, and adhering the microspheres (6) on the tip plate (8); and finally, melting the wax sheet film, taking the glass slide (4) away, washing away the residual wax on the surface of the microspheres (6), thereby obtaining the multi-tip array. With the method provided by the invention, the obtained mutli-tip array has good planeness, and height of each tip is consistent; and preparation of the multi-tip array is simple, low-cost and easy to carry out.

Description

technical field [0001] The invention relates to a method for preparing a multi-point array for large-area micromachining. Background technique [0002] Micro-nano devices are widely used in advanced manufacturing, aerospace, military, biotechnology, computer and communication and other fields, and micro-nano processing technology, as one of the important processing technologies, is the basis for realizing the micro-nano functional structure of devices. With the help of micro-nano processing technology, people can design and prepare micro-nano materials or micro-nano structure devices and devices with excellent performance, develop methods and instruments for detecting and analyzing physical, chemical and biological phenomena at the nanoscale, and accurately characterize nanomaterials. Or the physical properties of nanostructures, exploring new laws and phenomena of material movement at the nanoscale. As one of the main technologies of micro-nano processing, scanning probe t...

AI Technical Summary

Problems solved by technology

The disadvantage is that the surface of the prepared microneedles is relatively rough, the length of the microneedles that can be processed is limited by the laser defocus, and the cost is relatively high

In addition, the method of inversion molding is also a feasible method for preparing multi-tip arrays. The preparation steps are simple and the cost is low; Consistent, it is difficult to guarantee the flatness of the multi-tip array, and the neatness of the multi-tip array plane for large-area micromachining is a large-area micromachining (multi-tip parallel processing), to ensure that the processed micro-nano hole grooves, protrusions and other structures Therefore, it is urgent to develop a multi-tip array preparation method that can ensure the flatness of the multi-tip array

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