Thermal protection-type varistor
A varistor and thermal protection technology, applied in varistors, overvoltage protection resistors, resistors, etc., can solve the problem of unsatisfactory module miniaturization design, unfavorable automation, large-scale production, slow temperature transmission feedback, etc. problems, to achieve the effect of simple product structure, flexible design, and improved ability to withstand high-current shocks
Inactive Publication Date: 2016-08-24
THINKING ELECTRONIC IND CO LTD
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Problems solved by technology
[0004] 1. The product is large in size and occupies a large installation space, which cannot meet the miniaturization design of the module;
[0005] 2. Due to the influence of the shell and the installation position of the thermal fuse, the speed of temperature transmission and feedback is slow, which is not conducive to disconnecting the power supply in time;
[0006] 3. The assembly of product components is complicated, which is not conducive to automation and large-scale production
Method used
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[0024] The present invention will now be described in further detail in conjunction with the accompanying drawings and preferred embodiments. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.
[0025] figure 1 , 2 What is shown is the structure of the varistor in the prior art; its disadvantages are as described in the background art, and will not be repeated here.
[0026] image 3 and Figure 4 It is a schematic diagram of the structure of the present invention, including a pressure-sensitive chip, a thermal fuse, an intermediate electrode, a lead wire, and an encapsulation coating; the surface of the pressure-sensitive chip is coated with a metal electrode layer; one end of the wire is connected to a silver electrode Layer welding or welding through the fuse, intermediate electrode and pressure-sensitive ele...
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The invention relates to a thermal protection-type varistor, which comprises a pressure-sensitive chip, a thermal fuse, lead wire pins and an encapsulating coating, wherein the surface of the pressure-sensitive chip is coated with a metal electrode layer; one end of each lead wire pin is directly welded with the metal electrode layer or is welded with the metal electrode layer through the thermal fuse and an intermediate electrode; welding spots are formed; the other end of each lead wire pin extends out of the encapsulating coating and is connected with the outside; and the encapsulating coating coats the pressure-sensitive chip, the thermal fuse and one end of each lead wire pin. The thermal protection-type varistor is simple in structure; through the arranged intermediate electrode, the contact area with an electrode of the varistor is ensured; the high-current shock resistance of the product is effectively improved; through introduction of the intermediate electrode, heat conduction is facilitated; arcing when the fuse is blown out is avoided; the reaction speed of the blown fuse is increased; by overall paint encapsulation, an encapsulating paint simultaneously plays roles in isolation of the fuse and the varistor and overall encapsulation of the product; and the technology is simplified.
Description
technical field [0001] The invention relates to a piezoresistor, in particular to a heat protection type piezoresistor. Background technique [0002] Due to its superior volt-ampere characteristic curve and low production cost, varistors are widely used in electronic circuit overvoltage and surge protection. However, due to excessive overvoltage abnormalities in electronic circuits, varistors Frequent action of the device, performance degradation, failure, and serious breakdown and burning of the piezoresistor itself will cause other surrounding resistance components to burn and cause greater losses; [0003] In the existing market, traditional finished fuses are generally used in series with varistors, shrapnel structures and varistor structures. For example, there are mainly the following shortcomings: [0004] 1. The product is large in size and occupies a large installation space, which cannot meet the miniaturization design of the module; [0005] 2. Due to the influe...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01C7/12H01C1/034H01C1/144C09D5/18
CPCH01C7/126C09D5/18H01C1/034H01C1/144
Inventor 韩纪念高冲冲隋介衡黄任亨李晓乐
Owner THINKING ELECTRONIC IND CO LTD