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High-strength PC modified carrier tape material

A modified material, high-strength technology, applied in layered products, synthetic resin layered products, chemical instruments and methods, etc., can solve the problems of easy formation of holes, poor temperature resistance, low material strength, etc., and achieve simple manufacturing. , good temperature resistance, low manufacturing cost

Active Publication Date: 2016-10-12
浙江三和塑料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Ordinary materials have poor temperature resistance, are easy to form holes in the molding process, and the material strength is low, and the material is easy to break

Method used

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  • High-strength PC modified carrier tape material

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Experimental program
Comparison scheme
Effect test

Embodiment

[0035] Step 1) Stir 20KG pure PC material, 1KG GABS material, 50g phase solvent, 25g antioxidant 168, / 025g antioxidant 1076 in a sealed high-speed mixer at room temperature for 3 minutes (slowly heat during the period), and wait for the mixing tank After the body temperature reaches 50 degrees Celsius, stir again at high speed for 5 minutes.

[0036] Step 2) Use a twin-screw extruder to modify the mixture obtained in step 1) at a temperature of 220-250 degrees Celsius, extrude, pelletize, and shape, wherein the material has almost no Burrs and lint are significantly reduced after material slitting.

[0037] Step 3) The modified material obtained in step 2) is dried in a crystallization dryer at a temperature of 100 degrees Celsius for 3 hours, and then used as the main material (intermediate layer) of the PC carrier material, passed through the extruder (heating 200 -240 degrees Celsius) composite, the surface layer uses PS conductive masterbatch to obtain the carrier tape m...

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PUM

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Abstract

The invention discloses a high-strength PC modified carrier tape material. The high-strength PC modified carrier tape material comprises two surface layers which are symmetrically arranged, and an intermediate layer which is clamped between the two surface layers, wherein the surface layers are made of PS conductive materials, and the intermediate layer is made of a high-strength modified material; according to the invention, the surface layers and the intermediate layer are compounded, so that the carrier tape material has good temperature resistance and toughness to meet packaging requirements of electronic components in a high-strength and high-temperature environment, and is further very simple to manufacture, relatively low in manufacturing cost and suitable for popularization and application.

Description

technical field [0001] The invention relates to a high-strength PC modified carrier tape material. Background technique [0002] With the growing electronic industry, the miniaturization and miniaturization of electronic components is developing rapidly, and the requirements and consumption of packaging materials for electronic components are also increasing. The large-scale production of electronic components, the miniaturization and diversification of components require the improvement of the precision of the production process of the carrier tape, which also promotes the development of the carrier tape forming machine in the direction of standardization, automation, intelligence, high precision and high speed. [0003] Due to the application in the automatic SMT production process line, the performance requirements of the material are very high. The material must have high temperature resistance, high strength, strong toughness, stable resistance performance, and good Che...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B32B27/30B32B27/36C08L69/00C08L55/02C08K5/526C08K5/134
CPCB32B27/08B32B27/302B32B27/365C08L69/00C08L2201/08C08L2203/20C08L55/02C08K5/526C08K5/1345
Inventor 吴中心
Owner 浙江三和塑料有限公司
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