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Nanometer tungsten carbide enhanced aluminum magnesium alloy material for automobile electronic packaging and preparing method of nanometer tungsten carbide enhanced aluminum magnesium alloy material

A nano-tungsten carbide, automotive electronics technology, applied in the field of electronic packaging materials, can solve the problems of limited use range, alloy material strength, plasticity reduction, unsatisfactory nano-scale material dispersion in alloys, etc., to improve the stability of use. performance, improved wear resistance, and excellent encapsulation protection

Inactive Publication Date: 2016-10-12
BENGBU TIMES ELECTRONICS
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Problems solved by technology

The article "Preparation of Diamond / Al-Cu-based Composite Materials by Vacuum Hot Pressing Sintering Method" uses vacuum hot pressing sintering to improve the adverse reaction of the interface between diamond and aluminum, and at the same time adds Cu powder to improve the performance. This method uses micron-sized diamonds Powder, although a composite material with high thermal conductivity has been obtained, the strength and plasticity of the alloy material are reduced to a certain extent, and the scope of use is limited. Nano-scale inorganic materials have outstanding advantages in improving alloy properties, but nano-scale materials Dispersion in alloys is not satisfactory

Method used

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Embodiment Construction

[0015] A nano-tungsten carbide reinforced aluminum-magnesium alloy material for automotive electronic packaging, the alloy material is made of the following raw materials in parts by weight: 6% magnesium, 2% zinc, 1% molybdenum, 4% copper, 2% boron, nano-tungsten carbide Sol 40%, pore forming agent 1%, absolute ethanol 0.5, the balance is aluminum.

[0016] Among them, the nano-tungsten carbide sol is prepared by the following method: put dodecyltrimethylammonium bromide into absolute ethanol, stir until it is completely dissolved, then put in nano-tungsten carbide, disperse for 10 hours by ultrasonic oscillation, and obtain it; The weight ratio of tungsten carbide, absolute ethanol and dodecyltrimethylammonium bromide is 1:5:0.1.

[0017] The pore forming agent used is spherical urea.

[0018] The preparation method of the alloy material comprises the following steps:

[0019] (1) First mix aluminum, magnesium, zinc, molybdenum, copper, boron, pore-forming agent, and absolu...

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Abstract

The invention discloses a nanometer tungsten carbide enhanced aluminum magnesium alloy material for automobile electronic packaging. The alloy material comprises, by weight, 6%-8% of magnesium, 2%-4% of zinc, 1%-2% of molybdenum, 4%-5% of copper, 2%-3% of boron, 40%-60% of nanometer tungsten carbide sol, 1%-2% of a pore forming agent, 0.5%-1% of absolute ethyl alcohol and the balance aluminum.

Description

technical field [0001] The invention relates to the technical field of electronic packaging materials, in particular to a nano-tungsten carbide reinforced aluminum-magnesium alloy material for automotive electronic packaging and a preparation method thereof. Background technique [0002] Automotive electronics is the general term for automotive electronic control devices and on-board automotive electronic devices. Automotive electronics occupy a vital position in automotive technology and are the most important technical measures for developing new models and improving automotive performance. Due to the extreme operating temperature range, strong mechanical vibration, and many stains inside the car, to ensure that the performance of automotive electronic products will not be disturbed, it is necessary to do a good job in product packaging and select good packaging materials to achieve a better industry. Low cost, stronger functions, higher reliability and other technological...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C32/00C22C1/10
CPCC22C1/1026C22C21/00C22C32/0052
Inventor 朱兴堂朱亮亮陈军彦
Owner BENGBU TIMES ELECTRONICS
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