High-viscosity ultraviolet glue for sealing of LED (light emitting diode) lamp cups

A technology for LED lamps and sealing, applied in non-polymer adhesive additives, adhesives, epoxy resin glue, etc., can solve the problems of poor stability of shadowless glue, short storage period, easy to open glue, etc., and achieve good heat dissipation effect , strong stability, not easy to open the effect of glue

Inactive Publication Date: 2016-10-26
昆山初本电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The current shadowless glue used for sealing the lamp cup of the LED lamp is generally not a heat-conducting adhesive, which causes the heat in the lamp cup to be difficult to dissipate, and greatly shortens the service life of the LED lamp.
[0006] In addition, the existing shadowless glue used for sealing LED lamp lamp cups is generally less stable and has a short storage period.
[0007] In addition, the existing shadowless glue for sealing the lamp cup of the LED lamp has low viscosity and is easy to open the glue at low temperature

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] High-viscosity shadowless glue for LED lamp lamp cup sealing, including the following components by weight: 40 parts of prepolymer, 20 parts of diluent, 2 parts of photoinitiator, 10 parts of curing agent microcapsules, 1.5 parts of auxiliary agent, 2 parts of thermal conductive filler, 5 parts of thermal conductive silicone grease; the prepolymer includes epoxy resin and polyurethane modified acrylic resin.

[0031] The weight ratio of the epoxy resin and the polyurethane modified acrylic resin is 1:1.

[0032] The diluent includes one or more of isobornyl acrylate, tripropylene glycol diacrylate and pentaerythritol tripropylene triester.

[0033] The photoinitiator includes benzophenone compounds.

[0034] The curing agent microcapsules include microspheres that encapsulate the curing agent with a capsule material, and the diameter of the microspheres is 100 μm.

[0035] The preparation material of the curing agent microcapsules includes the following components by ...

Embodiment 2

[0047] High-viscosity shadowless adhesive for LED lamp lamp cup sealing, including the following components by weight: 60 parts of prepolymer, 30 parts of diluent, 5 parts of photoinitiator, 20 parts of curing agent microcapsules, 2 parts of auxiliary agent, 5 parts of thermal conductive filler, 10 parts of thermal conductive silicone grease; the prepolymer includes epoxy resin and polyurethane modified acrylic resin.

[0048] The weight ratio of the epoxy resin and the polyurethane modified acrylic resin is 1:1.

[0049] The diluent includes one or more of isobornyl acrylate, tripropylene glycol diacrylate and pentaerythritol tripropylene triester.

[0050] The photoinitiator includes benzophenone compounds.

[0051] The curing agent microcapsules include microspheres encapsulating the curing agent with a capsule material, and the diameter of the microspheres is 200 μm.

[0052] The preparation material of the curing agent microcapsules includes the following components by ...

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Abstract

The invention discloses high-viscosity ultraviolet glue for sealing of LED (light emitting diode) lamp cups. The high-viscosity ultraviolet glue is characterized by comprising, by weight, 40-60 parts of prepolymer, 20-30 parts of a diluents, 2-5 parts of a photoinitiator, 10-20 parts of curing agent microcapsules, 1.5-2 parts of auxiliaries, 2-5 parts of heat conduction filler and 5-10 parts of heat conduction silicone grease, wherein the prepolymer comprises epoxy resin and polyurethane modified acrylic resin. The high-viscosity ultraviolet glue for sealing of the LED lamp cups has heat conductivity and makes LED lamps excellent in heat radiation effect and long in service life, and the high-viscosity ultraviolet glue is high in viscosity and less prone to failure at a low temperature. In addition, the high-viscosity ultraviolet glue is high in stability and available for long-term storage, and a curing agent is less prone to reacting with other components.

Description

technical field [0001] The invention relates to a high-viscosity shadowless adhesive for sealing LED lamp lamp cups, belonging to the technical field of polymer adhesives. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the problem of heat dissipation has also been paid more and more attention. The light decay or lifespan of an LED is directly related to its junction temperature. If the heat dissipation is not good, the junction temperature will be high and the lifespan will be short. [0003] The reason why the LED heats up is that not all of the added electrical energy is converted into light energy, but part of it is converted into heat energy. The light efficiency of LED is currently only 100lm / W, and its electro-optical conversion efficiency is only about 20~30%. That is to say, about 70% of the electrical energy is turned into heat energy....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/14C09J183/04C09J11/04
CPCC09J163/00C08K2201/011C08L2203/20C08L2205/03C09J11/04C09J175/14C08L75/14C08L83/04C08K9/10C08K2003/282C08K7/24C08L63/00
Inventor 王玲
Owner 昆山初本电子科技有限公司
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