Pre-cleaning treatment method for stains adhering to surfaces of linearly-cut monocrystalline silicon fragments

Abstract

Provided is a pre-cleaning treatment method for stains adhering to surfaces of linearly-cut monocrystalline silicon fragments. The method sequentially comprises the following steps that a, the fragments are placed in a turnover box, tap water is added to soak the fragments, and then dirty water is drained; b, tap water is added to the turnover box, the White Cat non-phosphate formula cleanser essence is added to be evenly stirred, the White Cat non-phosphate formula cleanser essence diluent is formed, and the fragments are soaked in the diluent; c, NaOH caustic soda flakes of 1.5 kg are fetched and dissolved in water, the White Cat non-phosphate formula cleanser essence diluent is poured into the solution to be evenly stirred after the flakes are completely dissolved, mixed cleaning liquid is formed, the concentration of NaOH in the mixed cleaning liquid is controlled to be 2.5%-3%, the temperature of the mixed cleaning liquid is controlled to be 20-35 DEG C, and then soaking and stirring are carried out; and d, the turnover box is rinsed with tap water, and the cleaned fragments are obtained. The pre-cleaning treatment method has the beneficial effects that no mechanical production equipment is needed, operation is easy, the production cost is low, and throughput is high; and residual waste cutting liquid and adhesive stains of the fragments are removed thoroughly, and the subsequent chemical cleaning difficulty of the monocrystalline silicon fragments and the processing cost are reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing solar single and polycrystalline silicon wafers, in particular to the washing technology of monocrystalline silicon wire-cut fragments. Background technique [0002] In order to reduce production costs, recycling monocrystalline silicon wire-cut fragments is a must in the industry. How to completely remove the residue of cutting waste liquid and adherent dirt generated in the cutting process of the single crystal silicon wire cutting fragments will reduce the difficulty and processing cost of the subsequent chemical cleaning of the single crystal silicon fragments. is a subject. [0003] In the prior art, most of the cleaning equipment in the industry uses low-concentration NaOH solution to wash and remove the surface adhesion dirt of broken pieces during the cutting process, or use acid cleaning solution HF+H 2 o 2 +H 2 O is cleaned and removed. The first method requires equipment assis...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for pre-cleaning the adherent dirt on the surface of single crystal silicon wire-cut fragments, which overcomes the defects of the existing processing technology, and the processing cost is low and suitable for the production and use of the next process.