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Cooling fin for computer radiator

A heat sink and heat sink technology, applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve the problems of poor thermal conductivity, soft pure aluminum, small heat capacity, etc., and achieve strong corrosion resistance and high strength Effect

Inactive Publication Date: 2016-11-16
太仓鸿鑫精密压铸有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper has good thermal conductivity, but it is more expensive, difficult to process, too heavy (many pure copper radiators exceed the weight limit of the CPU), small heat capacity, and easy to oxidize
However, pure aluminum is too soft to be used directly. Only the aluminum alloy used can provide sufficient hardness. The advantages of aluminum alloy are low price and light weight, but the thermal conductivity is much worse than that of copper.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0010] Wherein, the heat sink for the computer radiator includes the combination of the outermost damping layer, the middle layer of thermal grease and the innermost matrix, the damping layer includes coal tar pitch, polyurethane, the The substrate is aluminum alloy, brass or bronze, the damping layer accounts for 11%-15% of the total weight of the cooling fins used in computer radiators, and the thermal conductive silicone grease accounts for 5% of the total weight of cooling fins used in computer radiators. %-6%, the base body accounts for 78%-86% of the total weight of the cooling fins used in computer radiators.

[0011] It is further illustrated that the thermally conductive silicone grease...

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PUM

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Abstract

The invention discloses a cooling fin for a computer radiator. The cooling fin for the computer radiator comprises a damp layer at the outermost layer, a heat-conducting silicone grease at the middle layer and a matrix at the innermost layer; the damp layer comprises coal tar pitch and polyurethane; the matrix is aluminum alloy, brass or bronze, the damp layer occupies 11%-15% of the total component of the cooling fin for the computer radiator, the heat-conducting silicone grease occupies 5%-6% of the total component of the cooling fin for the computer radiator, and the matrix occupies 78%-86% of the total component of the cooling fin for the computer radiator. The invention provides a cooling fin for the computer radiator. The cooling fin has the advantages of being high in strength, resistant in high voltage and strong in corrosion resistance.

Description

technical field [0001] The invention relates to a cooling fin used for a computer radiator. Background technique [0002] As far as the heat sink material is concerned, the thermal conductivity of each material is different, and the thermal conductivity is arranged from high to low, namely silver, copper, aluminum, and steel. However, it would be too expensive to use silver as a heat sink, so the best solution is to use copper. Although aluminum is much cheaper, it obviously does not conduct heat as well as copper (only about 50% of copper). [0003] At present, the commonly used heat sink materials are copper and aluminum alloy, both of which have their own advantages and disadvantages. Copper has good thermal conductivity, but it is expensive, difficult to process, too heavy (many pure copper radiators exceed the weight limit of the CPU), small in heat capacity, and easy to oxidize. However, pure aluminum is too soft to be used directly. Only the aluminum alloy used can...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 张健钱伟国
Owner 太仓鸿鑫精密压铸有限公司