Phenolic resin, epoxy resin composition containing the same, cured product of the epoxy resin composition, and semiconductor device having the cured product
A phenolic resin, epoxy resin technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of substrate material warpage, etc., achieve high thermal shrinkage rate, high thermal expansion rate, reduce warpage the effect of the song
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Embodiment 1
[0107] In a glass flask with a capacity of 300 parts equipped with a thermometer, a feeding / distillation outlet, a cooler and a stirrer, 134 parts (1.0 mol) of o-allylphenol, 32 parts (0.98 mol) of 92% paraformaldehyde, pure 0.4 parts of water and 1.1 parts of oxalic acid. After reacting at 100°C for 12 hours under reflux and further reacting at 160°C for 2 hours, it was cooled to 95°C. After cooling, 130 parts of pure water at 90°C or higher was thrown in and washed with water. Thereafter, by raising the internal temperature to 160° C. and performing a decompression-steaming treatment, unreacted components were removed to obtain a novolac resin A (R in general formula (1) is an allyl group, p=1 , q=1 novolac resin). The obtained novolac resin A had a softening point of 73° C., a melt viscosity at 150° C. of 4.3P, a hydroxyl equivalent of 170 g / eq, and a gelation time of 72 seconds. The compound of n=0 measured by gel permeation chromatography accounted for 5.9 area% of the...
Embodiment 2
[0109] In a glass flask with a capacity of 300 parts equipped with a thermometer, a feed / distillation outlet, a cooler and a stirrer, 134 parts (1.0 moles) of o-allylphenol, 36 parts (1.1 moles) of 92% paraformaldehyde, pure 0.4 parts of water and 1.1 parts of oxalic acid. After reacting at 100°C for 12 hours under reflux and further reacting at 160°C for 2 hours, it was cooled to 95°C. After cooling, 130 parts of pure water at 90°C or higher was thrown in and washed with water. Thereafter, by raising the internal temperature to 160° C. and performing a decompression-steaming treatment, unreacted components were removed to obtain a novolak resin B (R in general formula (1) is an allyl group, p=1 , q=1 novolac resin). The obtained novolak resin B had a softening point of 98°C, a melt viscosity at 150°C of 20P, and a hydroxyl equivalent of 172 g / eq.
Embodiment 3
[0111]In a glass flask with a capacity of 2000 parts equipped with a thermometer, a feed / distillation outlet, a cooler and a stirrer, 1200 parts (9.0 moles) of o-allylphenol, 127 parts (1.8 moles) of 42% formalin, And 12 parts of oxalic acid. The reaction was carried out at 100° C. for 7 hours under reflux. After completion of the reaction, 600 parts of pure water of 90° C. or higher were thrown in and washed with water. Thereafter, by raising the internal temperature to 160° C. and performing a decompression-steaming treatment, unreacted components were removed to obtain a novolac resin C (R in the general formula (1) is an allyl group, p=1 , q=1 novolac resin). The obtained novolak resin C was liquid at normal temperature, and had a hydroxyl equivalent of 141 g / eq.
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