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Circuit board structure with cooling function

A technology of circuit boards and functions, which is applied in the direction of printed circuits, printed circuits connected with non-printed electrical components, circuit heating devices, etc., can solve the problems of low cost and inability to apply products, so as to improve the use performance and improve the use performance and the effect of service life

Pending Publication Date: 2016-11-23
成都云士达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Single-sided panels are usually easy to manufacture and low in cost, but the disadvantage is that they cannot be applied to too complex products

Method used

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  • Circuit board structure with cooling function

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A circuit board structure with built-in heat dissipation function. A heat dissipation layer is set at the bottom of the circuit board structure to dissipate heat for the entire circuit board structure, effectively improving the performance of the circuit board structure, and adopting layered setting technology for different The circuit components of power consumption are packaged in layers, so as to effectively improve the performance and service life of the entire circuit structure, such as figure 1 As shown, the following structure is particularly arranged: a substrate layer 8, a semiconductor device mounting layer 6, an insulating layer 5, and a chip mounting layer 3 are provided, and a semiconductor device mounting layer 6 is arranged on one side of the substrate layer 8, and the insulating layer 5 is arranged on the opposite surface of the substrate layer 8 on the semiconductor device mounting layer 6, and the chip mounting layer 3 is arranged on the opposite surfac...

Embodiment 2

[0027] This embodiment is further optimized on the basis of the above-mentioned embodiments. Further, in order to better realize the present invention, it can facilitate the connection of various components of the circuit, such as figure 1 As shown, the following arrangement structure is particularly adopted: on the surface of the substrate layer 8 that is in contact with the semiconductor device mounting layer 6 and the heat dissipation layer 10, circuit traces 9 are also arranged.

Embodiment 3

[0029] This embodiment is further optimized on the basis of any of the above-mentioned embodiments. Further, in order to better realize the present invention, the semiconductor devices in the circuit can be separately arranged on the structural layer of the circuit board, thereby avoiding large power consumption devices and When devices with low power consumption are mixed, poor heat dissipation occurs, such as figure 1 As shown, the following arrangement structure is adopted in particular: the semiconductor device 7 is further arranged on the semiconductor device mounting layer 6 .

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Abstract

The invention discloses a circuit board structure with a cooling structure. The circuit board structure is provided with a base plate layer (8), a semiconductor device mounting layer (6), an insulation layer (5) and a chip mounting layer (3), wherein the semiconductor device mounting layer (6) is arranged on one surface of the base plate layer (8); the insulation layer (5) is arranged on the opposite surface, where the base plate (8) is arranged, of the semiconductor device mounting layer (6); the chip mounting layer (3) is arranged on the opposite surface, where the semiconductor device mounting layer (6) is arranged, of the insulation layer (5); and a cooling layer (10) is arranged on the opposite surface, where the semiconductor device mounting layer (6) is arranged, of the base plate layer (8). The cooling layer is arranged at the bottom layer of the circuit board structure and is used for cooling the whole circuit board structure, so that the usability of the whole circuit board structure is effectively improved; and a layered setting technology is adopted to carry out layered packaging on circuit components with different power consumptions, so that the usability of the whole circuit board structure is effectively improved and the service life of the whole circuit board structure is effectively prolonged.

Description

technical field [0001] The invention relates to the field of circuit structure and the like, specifically, a circuit board structure with heat dissipation function. Background technique [0002] The names of circuit boards are: circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board can be called printed circuit board or printed circuit board, the English name is (Printed Circuit Board) PCB, (Flexible Printed Circuit board) FPC circuit board (FPC circuit board is also called flexible circuit board) Or polyester film as the base material is a highly reliable, excellent flexible printed circuit board. It has the character...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0209H05K1/181H05K1/185H05K2201/06
Inventor 姚清群
Owner 成都云士达科技有限公司
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