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Curable resin composition, article, and method for fabricating the same

A technology for hardening resin and forming products, applied in the field of hardening and forming products, their manufacture, and hardenable epoxy resin compositions, which can solve the problems of easy embrittlement, low thermal cracking temperature, poor toughness, etc.

Inactive Publication Date: 2016-12-07
LEE CHANG YUNG CHEM IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the poor toughness and low thermal cracking temperature of existing epoxy resins, there are disadvantages such as easy embrittlement, poor fatigue resistance, and poor heat resistance, which limit its application.

Method used

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  • Curable resin composition, article, and method for fabricating the same
  • Curable resin composition, article, and method for fabricating the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] 20 parts by weight of pyromellitic dianhydride (manufactured and sold by Alfa Aesar), 1 part by weight of tin(II)2-ethylhexanoate (manufactured and sold by Alfa Aesar) ) and 0.1 parts by weight of 2-ethyl-4-methylimidazole (2-ethyl-4-methylimidazole) (with a product number of EMI-24, manufactured and sold by T.C.I) into a reaction bottle, and Tetrahydrofuran (THF) was added as a solvent. Then, after sufficient stirring, 100 parts by weight of epoxy resin (diglycidylether of bisphenol A) (having a product number of DER 383, manufactured and sold by Dow Chemical Company) was added to the in the reaction vial. After sufficient stirring, resin composition (I) was obtained. The resin composition (I) is formed into a coating and the coating is subjected to a heat treatment, wherein the process temperature of the heat treatment is 100°C. The coating formed from the resin composition (I) was completely cured within 40 minutes to obtain a cured product. Next, the thermal dec...

Embodiment 2

[0023] 20 parts by weight of pyromellitic dianhydride (manufactured and sold by Alfa Aesar), 1 part by weight of tin(II)2-ethylhexanoate (manufactured and sold by Alfa Aesar) ) and 0.1 parts by weight of 2-ethyl-4-methylimidazole (2-ethyl-4-methylimidazole) (with a product number of EMI-24, manufactured and sold by T.C.I) into a reaction bottle, and Tetrahydrofuran (THF) was added as a solvent. Then, after sufficient stirring, 100 parts by weight of epoxy resin (diglycidylether of bisphenol A) (having a product number of DER 383, manufactured and sold by Dow Chemical Company) was added to the in the reaction vial. After sufficient stirring, resin composition (II) was obtained. The resin composition (II) is formed into a coating and the coating is subjected to a heat treatment, wherein the process temperature of the heat treatment is 50°C. The coating formed from the resin composition (II) was completely cured within 24 hours to obtain a cured product. Next, the thermal dec...

Embodiment 3

[0025] 20 parts by weight of pyromellitic dianhydride (pyromellitic dianhydride) (manufactured and sold by Alfa Aesar), 0.5 parts by weight of tin (II) 2-ethylhexanoate (manufactured and sold by Alfa Aesar) ), and 0.3 parts by weight of 2-ethyl-4-methylimidazole (2-ethyl-4-methylimidazole) (with a product number of EMI-24, manufactured and sold by T.C.I) into a reaction bottle, and add Tetrahydrofuran (THF) was used as a solvent. Then, after sufficient stirring, 100 parts by weight of epoxy resin (diglycidylether of bisphenol A) (having a product number of DER 383, manufactured and sold by Dow Chemical Company) was added to the in the reaction vial. After sufficient stirring, resin composition (III) was obtained. Forming the resin composition (III) into a coating and performing a heat treatment on the coating, wherein the process temperature of the heat treatment is 100°C. The coating formed from the resin composition (III) was completely cured within 40 minutes to obtain a...

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PUM

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Abstract

A curable resin composition, an article, and a method for fabricating the same are provided. The curable resin composition includes an epoxy resin; an anhydride; and a catalyst. In particular, the catalyst includes an imidazole and an organic metal compound, and the organic metal compound includes an organic tin compound, organic zinc compound, organic nickel compound, organic cobalt compound, organic copper compound, organic chromium compound, or a combination thereof.

Description

technical field [0001] The present invention relates to a hardenable resin composition, a cured shaped product, and a manufacturing method thereof, and particularly relates to a curable epoxy resin composition, a cured shaped product, and a manufacturing method thereof. Background technique [0002] Epoxy resin has been used on copper foil substrates and printed circuit boards for many years. The main reason is that epoxy resin has strong bonding strength with reinforcing materials (such as glass fiber cloth, etc.), and it will not volatilize when hardened. The composition and size are stable, and there will be no molding shrinkage. In addition, due to its excellent adhesion, mechanical strength, and electrical insulation properties, epoxy resins are also widely used in the fields of electronics and optics as coatings, adhesives, composite materials, or functional films. [0003] However, due to poor toughness and low thermal cracking temperature, existing epoxy resins have...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08G59/68C08L63/00C09D163/00
CPCC08G59/42C08G59/5073C08G59/686
Inventor 陈祐瑱蔡博年汪若蕙
Owner LEE CHANG YUNG CHEM IND CORP
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