Thin film temperature sensor and manufacturing method

A thin-film temperature and sensor technology, applied in the field of sensors, can solve the problems of large volume and slow response time, and achieve the effect of small volume, fast response time and high density

Active Publication Date: 2016-12-07
北京埃德万斯离子束技术研究所股份有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a thin film temperature sensor and its pr

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  • Thin film temperature sensor and manufacturing method
  • Thin film temperature sensor and manufacturing method
  • Thin film temperature sensor and manufacturing method

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preparation example Construction

[0038] see figure 2 , is a flowchart of a method for preparing a thin film temperature sensor according to a preferred embodiment of the present invention. Such as figure 2 As shown, the present invention also provides a method for preparing a thin-film temperature sensor, which can be used to prepare the above-mentioned thin-film temperature sensor. The preparation method comprises the following steps:

[0039] First, in step S1, a substrate 1 is provided.

[0040] Subsequently, in step S2, thin-film thermocouples are deposited on the substrate 1 by ion beam sputtering deposition technique. The thin-film thermocouple includes a positive thermocouple film 2 and a negative thermocouple film 3 , and the inner ends of the positive thermocouple film 2 and the negative thermocouple film 3 are butted to form a thermocouple junction 4 . The step S2 further includes:

[0041] S2-1, making a positive thermocouple film photoresist on the substrate 1, and fixing it on the workpiec...

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Abstract

The invention relates to a thin film temperature sensor and a manufacturing method. The thin film temperature sensor at least comprises a substrate, a thin film thermocouple, bonding pad films and a protective film, wherein the thin film thermocouple is formed on the substrate through the ion beam sputtering deposition technology; the thin film thermocouple comprises a positive pole thermocouple film and a negative pole thermocouple film, and the inner end of the positive pole thermocouple film and the inner end of the negative pole thermocouple film are in butt joint to form a thermocouple connection point; the bonding pad films are formed at the outer end of the positive pole thermocouple film and the outer end of the negative pole thermocouple film through the ion beam sputtering deposition technology and are used for being connected with an external lead; the protective film covers the thin film thermocouple through the ion beam sputtering deposition technology and covers the surface of the area, where the thin film thermocouple is located, of the substrate. The thin film temperature sensor is manufactured through the ion beam sputtering deposition technology, multiple layers of the manufactured thin films are high in density and high in adhesive force, the plated thin film thermocouple is small in thickness and quick in temperature response, and after being packaged, the thermocouple is small in size and high in measurement precision.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a thin-film temperature sensor and a preparation method. Background technique [0002] Sensor technology, together with communication technology and computer technology, constitutes the three pillars of the modern information industry. It is a high-tech development that is attracting attention in the world today, and it is also a bottleneck industry that is relatively backward in communication and computer technology. Traditional sensors have been gradually eliminated due to the difficulty in meeting the requirements of modern computer technology and communication technology for sensor accuracy, reliability, environmental resistance, and information processing capabilities due to their functions, characteristics, and volume. A temperature sensor is a sensor that senses temperature and converts it into a usable output signal, mainly including thermal resistors, thermistors, thermo...

Claims

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Application Information

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IPC IPC(8): G01K7/04C23C14/46
Inventor 刁克明
Owner 北京埃德万斯离子束技术研究所股份有限公司
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