Water cutter device for cutting sapphires

A sapphire and waterjet technology, applied in the field of processing, can solve problems such as material cracks, laser difficulties, and ablation

Active Publication Date: 2016-12-14
TDG YINXIA NEW MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The low-cost and high-efficiency electrical discharge (EDM) processing technology has been successfully used in the processing of metal products, but due to the insulating properties of sapphire, this processing technology for high hardness and high wear-resistant materials cannot be applied to sapphire
In addition, due to the chemical stability and high temperature resistance of sapphire, the way of chemical pro

Method used

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  • Water cutter device for cutting sapphires
  • Water cutter device for cutting sapphires

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Embodiment Construction

[0025] as attached figure 1 , 2 As shown, a waterjet device for cutting sapphire includes: waterjet machine tool, computer control system, abrasive water jet system, acid spray system, and laser positioning device; wherein, the computer control system is used to control the various parts of the waterjet machine tool The computer control system is also used to control the opening and closing of the abrasive water jet system, the opening and closing of the acid spray system and the jet pressure of the abrasive water jet system; the abrasive water jet system is used to spray ultra-high pressure abrasive water jet to The sapphire workpiece 9 is cut; the acid spray system is used to apply the acid solution at the incision, so that the acid solution is bombarded by the ultra-high pressure abrasive water jet and then impacts the sapphire workpiece 9 at high speed for coordinated chemical processing; the laser positioning device is used for the sapphire workpiece 9 Cutting points pro...

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PUM

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Abstract

The invention discloses a water cutter device for cutting sapphires. The water cutter device comprises a water cutter machine tool, a computer control system, an abrasive water jet system, an acid liquor spray system and a laser positioning device; the computer control system is used for controlling coordinated action of parts of the water cutter machine tool, and controlling start and stop of the abrasive water jet system and the acid liquor spray system as well as jet pressure of the abrasive water jet system; the abrasive water jet system is used for jetting ultrahigh-pressure abrasive water jet flow to cut the sapphires; the acid liquor spray system is used for applying acid liquor to a cut, so that acid liquor impacts the sapphires at a high speed after being forced out by the ultrahigh-pressure abrasive water jet flow to carry out cooperative chemical processing; and the laser positioning device is used for assisting the acid liquor spray system to locate by projecting spots on workpiece cutting points. According to the water cutter device disclosed by the invention, water cutter cutting is introduced into the sapphire processing field, so that the problems that sapphires are difficult to cut and are high in processing cost are solved; and meanwhile, the characteristics of the sapphires and instability, caused by ultrahigh-pressure jet flow, of processing materials are combined, so that chemically assisted processing is designed.

Description

Technical field: [0001] The invention relates to the technical field of processing, in particular to a water jet device for cutting sapphire. Background technique: [0002] The synthetic sapphire used in industry is α-Al 2 o 3 In addition to the crystal clear visual beauty of natural sapphire, it also has many excellent physical and chemical properties, such as: high hardness (second only to diamond), high melting point (2054 ° C), good insulation (resistivity at room temperature is greater than 1011Ω·cm), good chemical stability (do not react with strong acid and alkali at room temperature, and react slowly at high temperature), etc. These excellent properties and the low cost of synthetic sapphire make it more and more applied to various Fields, including: LED substrate materials, mobile phone screens, watch mirrors, bulletproof glass, camera lenses, etc. [0003] Because sapphire is extremely hard and scratch-resistant, it is suitable for semiconductor and LED technolo...

Claims

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Application Information

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IPC IPC(8): B28D5/04
CPCB28D5/0058B28D5/04
Inventor 常慧程佳宝滕斌王国强张吉倪浩然康森
Owner TDG YINXIA NEW MATERIAL CO LTD
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