Novel busbar and manufacturing method thereof

A busbar, a new type of technology, applied in the direction of chemical instruments and methods, printed circuit manufacturing, cable/conductor manufacturing, etc., can solve the problems that do not conform to the development trend of product miniaturization, cannot realize circuit connection, and is easy to generate electromagnetic interference, etc., to achieve Good product quality, reduce electromagnetic interference, and maintain the effect of product quality

Inactive Publication Date: 2016-12-14
深圳众力新能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The circuit connection between the PCB low-voltage control layer and the busbar high-voltage and high-current layer cannot be realized, and the PCB and busbar can only be connected to the system separately through conductive lines;
[0006] 2. The high-current lines on the busbar layer and the signal

Method used

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  • Novel busbar and manufacturing method thereof
  • Novel busbar and manufacturing method thereof
  • Novel busbar and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0040] Example one

[0041] Please refer to figure 1 , The embodiment of the present invention provides a new type of busbar 10.

[0042] The new type of busbar 10 includes the following layers that are pressed into one in order: an insulating layer 11, a busbar 12, an insulating material 13, and a printed circuit board PCB 14;

[0043] Wherein, there is an adhesive sheet 15 between any two adjacent layers of the insulating layer 11, the busbar 12, the insulating material 13, and the PCB 14;

[0044] The busbar 12 is inlaid by insulating plates 121 and copper bars 122;

[0045] The busbar 12 and the PCB 14 are electrically connected through an interlayer conduction structure.

[0046] Wherein, the bonding sheet 15 may include: a first bonding sheet 151 between the insulating layer 11 and the busbar 12, a second bonding sheet 152 between the busbar 12 and the insulating material 13, and The third bonding sheet 153 between the material 13 and the PCB 14.

[0047] Among them, the bonding sh...

Example Embodiment

[0074] Embodiment two

[0075] Please refer to Figure 4 , The embodiment of the present invention provides a method for manufacturing a novel busbar, which may include:

[0076] 400. Material selection and cutting:

[0077] In the embodiment of the present invention, by analyzing the laminated structure and high temperature resistance characteristics of the new busbar, and after a series of experimental verifications, several insulating materials and glue systems satisfying this scheme have been obtained.

[0078] Such as figure 1 As shown, the new busbar 10 includes the following layers: an insulating layer 11, a busbar 12, an insulating material 13, and a printed board PCB 14; and there are adhesive sheets 15 between the above adjacent layers; the busbar 12 is composed of The insulating board 121 and the copper bar 122 are inlaid.

[0079] Optionally, the insulating plate 121 and the insulating material 13 are made of FR4 material;

[0080] Optionally, the insulating layer 11 is made...

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PUM

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Abstract

The invention discloses a novel busbar, which comprises an insulating layer, a busbar (busbar), an insulating material and a printed board (PCB) which are sequentially laminated into a whole, wherein a bonding sheet is arranged between any two adjacent layers of the insulating layer, the busbar, the insulating material and the PCB; the busbar is formed by inlaying an insulating plate and a copper bar; and the busbar is electrically connected with the PCB through an interlayer conduction structure. The embodiment of the invention further provides a manufacturing method of the novel busbar. The novel busbar disclosed by the technical scheme is of an integrally laminated molded structure; and a plurality of disadvantages due to the fact that the PCB and the busbar are installed together in a bracket fixing manner in the prior art can be overcome.

Description

technical field [0001] The invention relates to the technical field of busbar production, in particular to a novel busbar and a production method thereof. Background technique [0002] Bus bar (English name busbar), also known as laminated bus bar, laminated bus bar, is a single-layer or multi-layer structure connection bar, which can be regarded as a highway for power distribution systems. [0003] The current busbar does not have the function of installing a PCB (Printed Circuit Board, printed board), and the PCB in the system needs to be fixed on the busbar through a bracket. In the prior art, usually after the Busbar and the PCB are respectively formed, the PCB and the busbar are installed together in a bracket-fixed manner. [0004] In practice, it has been found that this method has the following defects: [0005] 1. The circuit connection between the PCB low-voltage control layer and the busbar high-voltage and high-current layer cannot be realized, and the PCB and ...

Claims

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Application Information

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IPC IPC(8): H05K3/30H01B13/00B32B27/06B32B33/00
CPCH05K3/305B32B27/06B32B33/00H01B13/00H05K2203/06
Inventor 李新强孙铮望璇睿赵铁良田幸哲杨凌
Owner 深圳众力新能源科技有限公司
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