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A fpga-based wafer detection signal extraction method

A technology for detecting signals and extracting methods, applied in the direction of optical test flaws/defects, etc., can solve the problems of analog signal extraction and processing methods that have not yet appeared, and achieve the effects of stable processing, ensuring accuracy, and improving processing efficiency

Active Publication Date: 2019-04-16
中国科学院嘉兴微电子仪器与设备工程中心
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Problems solved by technology

Since the scattered light is very weak when the size of the contamination on the wafer is small, how to improve the detection sensitivity is the main challenge of this method
The main principle of the current wafer inspection method and wafer inspection device is to use the light spots with periodic distribution of synthetic light intensity to realize the periodic modulation of the scattered signal, so that the signal is concentrated to a specific frequency, because the system noise is nearly uniform in the wide spectrum Distribution, by performing signal analysis around a specific frequency to eliminate the influence of part of the noise to improve sensitivity, but the analog signal extraction and processing methods for wafer inspection devices have not yet appeared

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  • A fpga-based wafer detection signal extraction method

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Embodiment Construction

[0042] The embodiment of the present invention improves the extraction efficiency of the analog signal detected by the wafer detection device by providing an FPGA-based wafer detection signal extraction method, and the processing of the extracted wafer signal is more stable and sensitive, ensuring data processing accuracy.

[0043] see figure 1 , the embodiment of the present invention provides a method for extracting wafer detection signals based on FPGA, comprising:

[0044] Step S1, collecting the wafer detection analog signal, and converting the wafer detection analog signal into a digital signal. Step S1 specifically includes: Step S11, collecting the wafer detection analog signal from the wafer detection device, and converting the wafer detection analog signal into a digital signal. When collecting the wafer detection analog signal, the unit acquisition capacity of the analog signal is 14bit, and the acquisition frequency is 500MHz.

[0045] Step S2, storing the data ...

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Abstract

The invention relates to the technical field of wafer detection, in particular to a wafer detection signal extraction method based on a FPGA (field programmable gate array). The method includes: collecting wafer detection analog signals, and converting the same into digital signals; storing data in the digital signals into a buffer region according to a time sequence unit the data reaches a specified number; performing time domain processing and frequency domain processing on the data of the buffer region; searching time domain signals and frequency domain signals, combining and judging the same, and then uploading the same to an upper computer. By the method, extraction efficiency of analog signals detected by a wafer detection device is improved, and processing of data in extracted wafer signals is more stable, more accurate and more sensitive.

Description

technical field [0001] The invention relates to the technical field of wafer detection, in particular to an FPGA-based method for extracting wafer detection signals. Background technique [0002] Wafer growth is the foundation of the semiconductor industry. Due to the influence of materials, equipment, and environmental factors, particle contamination will inevitably occur on the surface of the wafer. Therefore, how to ensure the quality of the wafer by detecting the number and density of particle contamination Normal growth has become a key link. The scanning detection method using light scattering has the advantages of fast speed and no additional pollution, and is currently the main method for comprehensive wafer detection in the semiconductor industry. Its basic principle is to use a small spot to irradiate the wafer surface with oblique incidence. Since the wafer surface is very smooth, when there is no pollution at the spot where the spot is irradiated, all the incide...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/94
CPCG01N21/94
Inventor 陈鲁刘虹遥马砚忠张朝前杨乐路鑫超
Owner 中国科学院嘉兴微电子仪器与设备工程中心