A kind of preparation method of copper-based pantograph sliding plate
A pantograph sliding plate, copper-based technology, applied in the field of preparation of copper-based pantograph sliding plate, can solve the problems of complex powder metallurgy process, easy pollution of powder interface, poor interface bonding, etc., and achieve good electrical conductivity and wear resistance Good performance and high density
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0024] Such as figure 2 The process flow, the MoS with a particle size of 50nm 2 The powder is granulated into 1mm spherical particles, and the 1mm particles are bonded with epoxy resin as figure 1 In the hexagon (the area surrounded by the hexagonal particle group is 60 square millimeters), three hexagons are bonded into a hexagonal particle group with a thickness of 3mm; then multiple hexagonal MoS 2 The particle group is bonded to the inner wall of the casting mold of the carbon-sprayed pantograph slide material, and makes the MoS 2 The distance between the particle group and the particle group is kept 2mm; finally, the molten copper (surface layer covered with activated carbon) at 1100°C is poured into the casting mold at a pouring temperature of 1090°C to obtain MoS 2 Reinforced copper-based pantograph slide material.
Embodiment 2
[0026] Such as figure 2 The process flow, the MoSe with a particle size of 1000nm 2 The powder is granulated into 0.1mm spherical particles, and the 0.1mm particles are bonded with epoxy resin as figure 1 In the square (the area surrounded by the square particle group is about 9 square millimeters), 6 squares are bonded into a square particle group with a thickness of 0.6mm; then multiple square particle groups are bonded to the carbon-sprayed The pantograph slide material casts the inner wall of the mould, and makes the MoSe 2 The distance between the particle group and the particle group is kept 15mm; finally, the molten copper (surface layer covered with activated carbon) at 1150°C is poured into the casting mold at a pouring temperature of 1100°C to obtain MoSe 2 Reinforced copper-based pantograph slide material.
Embodiment 3
[0028] Such as figure 2 The process flow is to granulate graphite powder with a particle size of 50um into spherical particles of 0.5mm, and bond the 0.5mm particles with epoxy resin to form figure 1 The round rod shape in the middle, and make the diameter of the particle group of the round rod reach 2mm; Then a plurality of round rods with a diameter of 2mm are bonded to the inner wall of the casting mold of the pantograph slide plate material through carbon spraying, and the graphite Keep a distance of 10mm between the powder particle group and the particle group; finally pour the molten copper (covered with activated carbon) at 1200°C into the casting mold at a pouring temperature of 1180°C to obtain graphite-reinforced copper-based pantograph slide material .
PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 

