Board laser shocking riveting die, riveting system and laser shocking riveting method

Abstract

The invention discloses a board laser shocking riveting die, a riveting system and a laser shocking riveting method. The board laser shocking riveting die comprises an upper die and a lower die; the upper die is a male die, the lower surface of the upper die forms a press-down face to a board, and the upper die is made of a transparent material; the lower surface or / and the lateral surface of the lower end of the upper die is covered with an energy adsorption layer, or the upper surface of a to-be-riveted region of the board is coated with the energy adsorption layer, and when a material in the energy adsorption layer is irradiated by laser, ionization is carried out to form plasma; the lower die is a female die, a groove is formed in the female die, an internal width of the groove is greater than a width of an opening at the upper end of the groove, and the groove is formed by assembling two opposite parts; a width of the press-down face of the upper die is smaller than the width of the opening at the upper end of the groove. The board laser shocking riveting die, the riveting system and the laser shocking riveting method have the advantages that a riveting depth is large; an interlocking embedding quantity of riveting buckles is great; the surface of the board does not need to be specially processed; the board laser shocking riveting die, the riveting system and the laser shocking riveting method are very suitable for multi-pulse laser shocking riveting; and the like.

Description

technical field [0001] The invention belongs to the field of advanced laser manufacturing, and in particular relates to a plate laser impact riveting mold, a riveting system and a laser impact riveting method. Background technique [0002] With the rapid development of industries such as automobiles and airplanes, the requirements for sheet metal connection technology are getting higher and higher, and a variety of rivetless connection technologies have emerged as the times require. Chinese patent document 200810014018.1 first proposed a pulse laser micro-riveting method for ultra-thin plates and its special device. This method uses the explosive plasma shock wave induced by the pulsed laser beam to separate the upper plate with a thickness of less than 0.1mm and the lower plate with holes. riveted together. Since the pre-set holes in the lower plate will affect the sealing performance of the connectors, and at the same time, in order to further improve the connection stren...

AI Technical Summary

Problems solved by technology

Obviously, a smaller lateral impact force will inevitably lead to a smaller bottom size, and a smaller size difference between the mouth and the bottom, and eventually lead to a small amount of embedding, insufficient mechanical interlock and low connection strength.

(3) Although the riveting and welding composite structure formed by the synchronous riveting and welding method can greatly improve the connection strength of the plates, this method requires the plates to have a very clean surface, otherwise it is difficult to weld through high-speed impact

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