Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

One-chip type quartz resonance pressure/temperature sensor and technological method therefor

A temperature sensor, monolithic technology, applied in thermometers, thermometers using electric/magnetic elements that are directly sensitive to heat, measurement of properties and forces using piezoelectric devices, etc., can solve difficult process, resonant quartz crystal Problems such as large volume of pressure/temperature sensor

Inactive Publication Date: 2017-01-11
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
View PDF6 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The present invention aims to solve the problems that the existing resonant quartz crystal pressure / temperature sensor has large volume, high process difficulty, further improvement of temperature stability and time stability, and therefore provides a single-chip quartz resonant pressure / temperature sensor and and its process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • One-chip type quartz resonance pressure/temperature sensor and technological method therefor
  • One-chip type quartz resonance pressure/temperature sensor and technological method therefor
  • One-chip type quartz resonance pressure/temperature sensor and technological method therefor

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0031] Specific implementation mode 1. Combination figure 1 Describe this embodiment, the monolithic quartz resonant pressure / temperature sensor described in this embodiment includes a pressure-compression force converter, a sensor housing 1, a monolithic heat-sensitive resonator 3, and a monolithic force-sensitive sensor 4 , reference pressure column 8, pressure port 9 and base 11;

[0032] The pressure-compression force transducer includes two pressure conducting columns 5 and a pressure guiding elastic diaphragm 2;

[0033] The lower ends of the two pressure conducting columns 5 are fixed on the upper surface of the pressure guiding elastic diaphragm 2, and form an integral part with the pressure guiding elastic diaphragm 2;

[0034] The reference pressure column 8 is a hollow tubular structure with a stepped gap at the top, and the bottom end of the reference pressure column 8 is a pressure port 9;

[0035]The top of the reference pressure column 8 is fixed on the lower ...

specific Embodiment approach 2

[0060] Specific Embodiment 2. This embodiment is a further description of the monolithic quartz resonant pressure / temperature sensor described in Specific Embodiment 1. It also includes a sealing ring 10, which is sleeved on the reference pressure column 8 On the column, and between the four circular through holes 6 on the reference pressure column 8 and the base 11 .

specific Embodiment approach 3

[0061] Specific embodiment three. This embodiment is a further description of the monolithic quartz resonant pressure / temperature sensor described in specific embodiment one. The lower part of the reference pressure column 8 is provided with an external thread, and the lower part of the reference pressure column 8 is threaded with the sealing nut. connect.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Resonant frequencyaaaaaaaaaa
Thicknessaaaaaaaaaa
Resonant frequencyaaaaaaaaaa
Login to View More

Abstract

A one-chip type quartz resonance pressure / temperature sensor and a technological method for a one-chip force sensor are disclosed, and the invention relates to a pressure / temperature sensor. A problem that a conventional resonant type quartz crystal pressure / temperature sensor is large in size, high in technological difficulty, low in precision and poor in stability can be solved. According to the one-chip type quartz resonance pressure / temperature sensor and the technological method for the one-chip force sensor, a cut model of a high stability force sensitive-thermosensitive quartz crystal, a structure of a high quality factor one-chip type force sensitive-thermosensitive resonator, a pressure / compressing force conversion structure, and a quartz low stress seal structure and technology are adopted; the low stress seal structure and technology are adopted; excellent elasticity of the quartz crystal, an SiC layer, monocrystalline silicon, borosilicate glass and Kovar alloy can be used while semiconductor technologies are employed. Although silicon and quartz materials are not equal in thermal expansion coefficient, buffering effects of the amorphous state SiC layer are used, and thermal stress of the quartz pressure / temperature sensor can be greatly lowered. The one-chip type quartz resonance pressure / temperature sensor is suitable for serving as the pressure / temperature sensor and the technological method for the one-chip force sensor can be applied to the pressure / temperature sensor.

Description

technical field [0001] The invention belongs to the field of piezoelectric resonance sensors of automation technology, and in particular relates to a monolithic quartz resonance pressure / temperature sensor and a process method thereof. Background technique [0002] Quartz resonant pressure sensor (abbreviated as QPS) is a high-precision, high-stable sensor with excellent metering factors—high precision, ultra-high resolution, and excellent long-term stability. At present, there are mainly three working modes of QPS: bulk acoustic wave mode (BAW), surface acoustic wave mode (SAW) and generalized surface acoustic wave mode or generalized bulk acoustic wave mode, such as surface shear wave (also known as shallow bulk acoustic wave or surface-grazing body wave) mode. Among them, the QPS with the widest range, the highest precision and the best long-term stability is the QPS with a thickness shear vibration full quartz structure that applies radial compression force. At present,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01L1/16G01K7/32
CPCG01K7/32G01L1/162
Inventor 宋国庆吴亚林姚东媛邹向光谢胜秋王凡
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products