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Compound adhesive

A composite adhesive, mass fraction technology, applied in the direction of adhesive types, rosin adhesives, cellulose adhesives, etc., can solve the problem of inability to bond wood, metal, plastic, poor slurry stability, and slurry Poor viscoelasticity and other problems, to achieve the effect of good transparency, good stability and high transparency

Inactive Publication Date: 2017-01-25
张勇健
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the adhesives that can be used for the molding of ceramic products mainly include acrylic acid series and polyvinyl alcohol-based adhesives, but acrylic acid has a big disadvantage when used in electronic ceramic molding, that is, the stability of the slurry is poor; and polyvinyl alcohol-based adhesives The mixture has the disadvantages of poor slurry viscoelasticity and inconvenient use.
Moreover, the existing ceramic adhesives have relatively single uses and cannot bond wood, metal, and plastics.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A composite adhesive is composed of the following ingredients in mass fraction: 10-15 parts of polyvinyl acetate, 13-15 parts of diethylene glycol dibenzoate, 6-8 parts of peroxide, and 10-12 parts of refractory mud , 6-10 parts of rosin, 5-7 parts of carboxymethyl cellulose, 6-8 parts of hydrochloric acid, 7-9 parts of octanol, 6-10 parts of fatty acid ester, 40-60 parts of water.

Embodiment 2

[0017] A composite adhesive is composed of the following mass fraction formula components: 10 parts of polyvinyl acetate, 13 parts of diethylene glycol dibenzoate, 6 parts of peroxide, 10 parts of refractory clay, 6 parts of rosin, carboxymethyl 5 parts of cellulose, 6 parts of hydrochloric acid, 7 parts of octanol, 6 parts of fatty acid, 40 parts of water.

Embodiment 3

[0019] A composite adhesive is composed of the following mass fraction formula components: 13 parts of polyvinyl acetate, 14 parts of diethylene glycol dibenzoate, 7 parts of peroxide, 11 parts of refractory clay, 8 parts of rosin, carboxymethyl 6 parts of cellulose, 7 parts of hydrochloric acid, 8 parts of octanol, 8 parts of fatty acid, 50 parts of water.

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PUM

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Abstract

The invention disclsoes a compound adhesive. The compound adhesive is prepared from the following formula components in parts by mass: 10 to 15 parts of polyvinyl acetate, 13 to 15 parts of di(ethylene glycol) dibenzoate, 6 to 8 parts of peroxide, 10 to 12 parts of refractory mortar, 6 to 10 parts of rosin, 5 to 7 parts of carboxymethyl cellulose, 6 to 8 parts of hydrochloric acid, 7 to 9 parts of octanol, 6 to 10 parts of fatty acid ester and 40 to 60 parts of water. The compound adhesive has good stability, high transparency and great viscosity and the cost is reduced; the compound adhesive can be used for adhering woods, metal and plastic.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a composite adhesive. Background technique [0002] In the molding of ceramics and their products, in order to improve the molding process and molding effect, it is often necessary to add binders, and most of the binders are discharged after the products are molded. All organic substances can be used as adhesives for ceramic molding after being dissolved and combined with additives. Stable, good transparency, beautiful appearance, suitable viscosity, and no adverse effect on the final performance of certain ceramic material products. At present, the adhesives that can be used for the molding of ceramic products mainly include acrylic acid series and polyvinyl alcohol-based adhesives, but acrylic acid has a big disadvantage when used in electronic ceramic molding, that is, the stability of the slurry is poor; and polyvinyl alcohol-based adhesives The mixture has the disadvantages of poo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J131/04C09J193/04C09J101/28C09J11/06C09J11/04C04B35/63C04B35/632C04B35/634C04B35/636
CPCC09J131/04C04B35/63C04B35/6303C04B35/632C04B35/63416C04B35/63492C04B35/6365C08L2201/10C08L2205/03C09J11/04C09J11/06C08L93/04C08L1/286C08K13/02C08K5/103C08K5/05C08K3/16
Inventor 张勇健
Owner 张勇健