Diamond wire slicing cooling liquid integrated treatment method for sapphire and silicon wafers

Abstract

The invention relates to a diamond wire slicing cooling liquid integrated treatment method for sapphire and silicon wafers. The treatment method comprises following steps that firstly, a first pipeline conveys waste cooling liquid drained by slicing machines to a storage tank; secondly, a plate frame pressure filter carries out pressure filtering to remove solid wastes in the cooling liquid; thirdly, a precise filter tank is used for carrying out precise filtering to remove fine particles and metal ions in the cooling liquid; fourthly, a fourth pipeline conveys the cooling liquid treated by the precise filter tank to a preparation tank, a PLC is controlled to enable a cooling liquid supplementing system to supplement cooling liquid to the preparation tank, and a finished product tank conveys the cooling liquid to a plurality of slicing machines through a fifth pipeline. The cooling liquid can be circularly used, the machining quality is improved, the equipment failure and switching time can be shortened, the product manufacturing cost is reduced, and the water treatment environment pollution is reduced.

Description

technical field [0001] The invention relates to an integrated processing method for sapphire and silicon chip diamond wire slice coolant, belonging to the technical field of photovoltaic material production. Background technique [0002] The processing methods of traditional sapphire slices and diamond wire silicon slices are as follows: [0003] 1. The equipment is equipped with a mixing tank with a stirring device, and the cooling water and coolant required for circulation are poured into each cutting. The internal circulation mode is adopted during the cutting process, and the concentration of the micropowder is required to meet the requirements of slicing. After one or more cuttings, it is replaced and discarded; [0004] 2. Due to the influence of micropowder, during the cutting process, the micropowder part will enter the bearing gap in the equipment, forming solidified deposits and affecting the operation of the bearing. It takes a certain time to rinse after each cu...

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Problems solved by technology

[0004] 2. Due to the influence of micropowder, during the cutting process, the micropowder part will enter the bearing gap in the equipment, forming solidified deposits and affecting the operation of the bearing. It takes a certain time to rinse after each cutting, and the equipment needs to be cleaned every certain cutting times. carry out a thorough cleaning;

[0006] Since sapphire slices and diamond wire silicon slices belong to the field of diamond wire slices, cooling water and coolant are required in the cutting process, and <50% of the materials will become fine powder when changing from bulk materials to thin slices during the cutting process Or the particles enter the cooling water, pollute the cutting environment, and the cutting precipitation solidifies, causing equipment failure and resulting in low cutting yield. At the same time, the polluted water needs to be discharged and enter the sewage treatment, which brings environmental protection pressure

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