A kind of low-hardness damping silica gel buffer material and preparation method thereof

A buffer material and low-hardness technology, applied in the field of low-hardness damping silica gel buffer material and its preparation, can solve the problems of endangering safety, poor high and low temperature resistance, reducing operation accuracy, etc., achieving good high and low temperature adaptability, reducing work Strength, not easy to aging and deformation effect

Active Publication Date: 2020-04-03
昆山市硕鸿电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of industrial production, vibration and noise have become serious problems in various fields: it will reduce operating accuracy, affect product quality, shorten product life, make high-precision instruments not work normally, and endanger safety, especially for some electronic products. It poses a threat to personal safety. Therefore, the development of shock-proof and noise-reducing cushioning materials has become a major issue facing the industrial development of various countries.
[0003] At present, people often use cushioning materials such as expanded polyethylene and expanded polystyrene to prevent shock and reduce noise. However, when these cushioning materials are used in some high-precision electronic instruments and light and thin electronic equipment, their high and low temperature resistance is poor. Very easy to aging and failure, seriously affecting the normal use of electronic instruments or electronic equipment

Method used

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  • A kind of low-hardness damping silica gel buffer material and preparation method thereof
  • A kind of low-hardness damping silica gel buffer material and preparation method thereof
  • A kind of low-hardness damping silica gel buffer material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0052] A low-hardness damping silica gel buffer material, which comprises the following components in parts by mass:

[0053]

[0054] In this embodiment, the liquid silica gel is polydimethylsiloxane, the hydrogen content in the hydrogen-containing silicone oil is 0.4wt / %, the viscosity of the liquid silica gel is 10000mPa·s at 25°C, and the viscosity of the methyl vinyl silicone oil The viscosity was 10000 mPa·s at 25°C.

Embodiment 2

[0056] A low-hardness damping silica gel buffer material, which comprises the following components in parts by mass:

[0057]

[0058] In this embodiment, the liquid silica gel is polydimethylsiloxane, the hydrogen content in the hydrogen-containing silicone oil is 0.8wt / %, the viscosity of the liquid silica gel is 100000mPa·s at 25°C, and the viscosity of the methyl vinyl silicone oil The viscosity was 100000 mPa·s at 25°C.

Embodiment 3

[0060] A low-hardness damping silica gel buffer material, which comprises the following components in parts by mass:

[0061]

[0062]

[0063] In this embodiment, the liquid silica gel is polydimethylsiloxane, the hydrogen content in the hydrogen-containing silicone oil is 0.6wt / %, the viscosity of the liquid silica gel is 30000mPa·s at 25°C, and the viscosity of the methyl vinyl silicone oil is The viscosity was 20000 mPa·s at 25°C.

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Abstract

The invention relates to the technical field of silicone, and in particular to a low-hardness damping silicone buffer material and a preparation method thereof. The low-hardness damping silicone buffer material comprises the following components in parts by mass: 50-80 parts of liquid silicone rubber, 5-50 parts of methyl vinyl silicone oil, 1-5 parts of hydrogen-containing silicone oil, 0.5-1.5 parts of a platinum catalyst and 0.01-0.05 part of an inhibitor. According to the low-hardness damping silicone buffer material provided by the invention, Si-H bonds of the hydrogen-containing silicone oil are activated to carry out a hydrosilylation addition reaction by the platinum catalyst, and an elastomer of a three-dimensional meshed structure is formed, so that the prepared low-hardness damping silicone buffer material has good high / low-temperature adaptation, excellent flexibility, good buffer performance and physiologically inert, is difficult to age and deform, can be widely applied to high-precision electronic instruments and light electronic devices and can achieve the buffering and damping effects; therefore, normal application of the electronic instruments or electronic devices is guaranteed.

Description

technical field [0001] The invention relates to the technical field of silicone rubber, in particular to a low-hardness damping silicone buffer material and a preparation method thereof. Background technique [0002] With the rapid development of industrial production, vibration and noise have become serious problems in various fields: it will reduce operating accuracy, affect product quality, shorten product life, make high-precision instruments not work normally, and endanger safety, especially for some electronic products. Threats to personal safety, therefore, the development of cushioning materials with shockproof and noise reduction functions has become a major issue facing industrial development in various countries. [0003] At present, people often use cushioning materials such as expanded polyethylene and expanded polystyrene to prevent shock and reduce noise. However, when these cushioning materials are used in some high-precision electronic instruments and light ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08L83/05C08L83/07
CPCC08L83/04C08L2205/025C08L2205/03C08L2205/035
Inventor 代树高
Owner 昆山市硕鸿电子科技有限公司
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