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SCR (Semiconductor Control Rectifier) with high maintaining voltage for ESD (Electro-Static Discharge) protection

A high sustaining voltage and uniform technology, applied in circuits, electrical components, electric solid devices, etc., can solve problems such as constraints, latch-ups, and low sustaining voltages, to ensure normal potential, ensure normal transmission, and improve latch-up resistance Effect

Active Publication Date: 2017-02-22
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

figure 1 The shown LVTSCR (Low Voltage Triggered Thyristor) is an ESD device with low trigger voltage and strong discharge capability, but such requirements make the LVTSCR device used for ESD protection must consider false triggering by voltage noise or static electricity to enter Signal false flips caused by deep retracement regions (e.g. figure 2 shown), in order to prevent this from happening, the maintenance voltage of the ESD structure must clamp the voltage from the I / O port to GND above the power supply voltage, and the LVTSCR structure has a large current capacity and a small chip footprint The area has become a potential anti-static structure, but due to the low sustain voltage of the LVTSCR structure, its use has been restricted
The same ESD event may also occur between VDD and GND, the difference is that a low sustain voltage between VDD and GND will directly lead to the occurrence of latch-up

Method used

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  • SCR (Semiconductor Control Rectifier) with high maintaining voltage for ESD (Electro-Static Discharge) protection
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  • SCR (Semiconductor Control Rectifier) with high maintaining voltage for ESD (Electro-Static Discharge) protection

Examples

Experimental program
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Effect test

Embodiment 1

[0020] Such as Figure 4 As shown, the SCR with high sustain voltage for ESD protection in this example includes a P-type substrate 1, a first P-type epitaxial layer 201 and a second P-type epitaxial layer 202, and the first P-type epitaxial layer 201 Located on the same level as the second P-type epitaxial layer 202; between the upper surface of the P-type substrate 1 and the lower surface of the first P-type epitaxial layer 201 and the lower surface of the second P-type epitaxial layer 202, and the first P-type epitaxial layer The sides of the layer 201 and the side of the second P-type epitaxial layer 202 are all separated by the SOI layer 4; the upper layer of the first P-type epitaxial layer 201 has a first P+ region 21, a second P+ region 23, a first N+ region 22, The second N+ region 24 and the first N well 31, the first N well 31 is located on the side close to the second P-type epitaxial layer 202, the side of the first N well 31 is in contact with the SOI layer 4, th...

Embodiment 2

[0027] Such as Figure 5 As shown, the difference between this example and Example 1 is that the P epitaxial layer in Example 1 is replaced by an N epitaxial layer, the N well is replaced by a P well, and the second N well 32 is removed and formed in the corresponding area. P well, the difference is that the third P+ region 25 and the third N+ region 26 are placed in the P well, while half of the fourth P+ region 27 is located in the P well.

[0028]When this example is specifically used, its connection mode is the same as that of embodiment 1.

[0029] When designing, the current gain of NPN03 should be adjusted according to the required holding current, but the holding voltage cannot be increased without limit. If the current gain of NPN03 is increased, on the one hand, the base current of NPN02 can be reduced more, and the positive feedback effect of SCR can be further suppressed. But its too high current gain will also reduce the holding voltage of NPN03 when discharging...

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PUM

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Abstract

The invention belongs to the technical field of electronic science and technology, is mainly used for a static discharge protection technology and specifically relates to an SCR (Semiconductor Control Rectifier) with a high maintaining voltage for ESD (Electro-Static Discharge) protection. An SCR device provided by the invention is used for ESD protection of a low voltage 5V technology, an additional NPN transistor is utilized to weaken a positive feedback process in the SCR structure, and then the current positive feedback of the SCR has a weakening trend, so that the SCR can maintain voltage boosting and can increase the anti-latch capacity of the device. Besides, even if the noise interference is generated by a chip and the SCR is mistakenly started by the noise voltage, the structure still can ensure the normal potential and normal transmission of the signal.

Description

technical field [0001] The invention belongs to the field of electronic science and technology, and is mainly used for electrostatic discharge (Electro Static Discharge, referred to as ESD) protection technology. SCR). Background technique [0002] ESD stands for Electrostatic Discharge, which is a common phenomenon in nature. [0003] With the innovation of integrated circuit manufacturing process, the thinner line width and even thinner oxide layer greatly reduce the antistatic ability of the chip, so the impact of static electricity on the circuit is more obvious. There are also contradictions between the development of deep submicron and even nanometer processes and the anti-ESD ability of integrated chips, so designers must consider them. [0004] Electrostatic discharge can occur on various pins of the chip, some of these pins are I / O ports, some are power rails or GND. [0005] When the chip is working, the I / O port will output different logic signals, so the ESD p...

Claims

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Application Information

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IPC IPC(8): H01L23/60H01L27/02
CPCH01L23/60H01L27/02
Inventor 乔明齐钊杨文张波
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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