Heat-storage, thermally conductive sheet

A heat-conducting sheet and heat storage technology, applied in semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve problems such as easy damage, achieve uniform heat dissipation, reduce heating or hot spots, and reduce thermal resistance.

Inactive Publication Date: 2017-02-22
FUJI POLYMER INDUSTRIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is also the problem that the microcapsules are easily broken when mixed with the matrix resin material

Method used

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  • Heat-storage, thermally conductive sheet
  • Heat-storage, thermally conductive sheet
  • Heat-storage, thermally conductive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] 1. Material composition

[0101] (1) Silicone ingredients

[0102] A two-component room temperature curing silicone rubber was used as the silicone component. In addition, a base polymer component (component A), a crosslinking component (component B), and a platinum-based metal catalyst (component C) are added in advance to the two-liquid RTV.

[0103] (2) Thermal storage inorganic particles

[0104] Vanadium dioxide particles (VO 2 ), and mix evenly to form a compound. Vanadium dioxide particles (VO 2 ) The latent heat generated by the electronic phase transition is 245J / cc.

[0105] 2. Sheet forming processing method

[0106] A metal frame with a thickness of 3 mm was placed on the polyester film subjected to mold release treatment, the composite was poured in, and another polyester film subjected to mold release treatment was placed. This was cured at 120° C. for 10 minutes under a pressure of 5 MPa to form a heat storage silicone rubber sheet with a thickness...

Embodiment 2

[0112] 1. Material composition

[0113] (1) Silicone ingredients

[0114] A two-component room temperature curing silicone rubber was used as the silicone component. In addition, a base polymer component (component A), a crosslinking component (component B), and a platinum-based metal catalyst (component C) are added in advance to the two-liquid RTV.

[0115] (2) Thermal storage inorganic particles

[0116] Vanadium dioxide particles (VO 2 ) and mix evenly.

[0117] 2. Sheet forming processing method

[0118] A sheet was molded in the same manner as in Example 1. Table 1 summarizes the physical properties of the obtained heat storage silicone rubber sheet.

[0119] [Table 1]

[0120] Example 1 Example 2 Silicone ingredients (parts by mass) 100 100 Addition amount of heat storage material particles (parts by mass) VO 2 : 600

VO 2 : 400

Heat storage (time to reach 42-85°C: seconds) 60 55 Thermal conductivity in thickness d...

Embodiment 3

[0126] This embodiment is an experimental example of a heat storage material, a composite product of a silicone rubber sheet (thickness 1.0mm) and a graphite sheet (thickness 0.1mm) added with heat dissipation fillers.

[0127] 1. Material composition

[0128] (1) Silicone ingredients

[0129] A two-component room temperature curing silicone rubber was used as the silicone component. In addition, a base polymer component (component A), a crosslinking component (component B), and a platinum-based metal catalyst (component C) are added in advance to the two-liquid RTV.

[0130] (2) Thermal storage inorganic particles

[0131] Vanadium dioxide particles (VO 2 ) and mix evenly.

[0132] (3) Thermally conductive filler

[0133] Alumina particles (Al 2 o 3 ) and mix evenly.

[0134] 2. Sheet forming processing method

[0135] A sheet was molded in the same manner as in Example 1. Table 2 summarizes the physical properties of the obtained heat storage silicone rubber sheet....

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Abstract

A heat-storage, thermally conductive sheet (3, 4, 5) which comprises a heat-storage sheet (1, 1a, 1b) comprising a matrix resin and heat-storage inorganic particles and a heat-diffusing material (2, 2a, 2b) integrated with the heat-storage sheet, wherein the heat-storage inorganic particles are constituted of a substance that undergoes an electronic phase transition and has a latent heat due to the electronic phase transition of 1 J / cc or greater, the heat-storage inorganic particles are contained in an amount of 10-2,000 parts by mass per 100 parts by mass of the matrix resin, the heat-storage sheet has a thermal conductivity of 0.3 W / mK or greater, and the heat-diffusing material has a thermal conductivity in a plane direction of 20-2,000 W / mK. Due to this, a heat-storage, thermally conductive sheet which is high in heat storage property and thermal conductivity, is physically stable, and has the excellent property of diffusing heat in plane directions is provided.

Description

technical field [0001] The present invention relates to a thermal storage thermally conductive sheet. In more detail, it is related with the heat storage heat conduction sheet excellent in the diffusivity of the heat of a plane direction. Background technique [0002] Semiconductors used in electronic equipment and the like generate heat during use, and the performance of electronic parts may degrade. Therefore, a metal radiator is usually mounted on a heat-generating electronic component via a gel-like or soft rubber-like heat conductive sheet. In recent years, a method has also been proposed in which a heat storage material sheet is attached to a heat generating electronic component, and heat is stored in the heat storage material sheet to slow down the heat transfer speed. In Patent Documents 1 and 2, heat storage rubber in which microcapsules incorporating a heat storage material are kneaded is proposed. Patent Document 3 proposes a heat countermeasure component in wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36B32B7/02B32B7/027
CPCH01L2924/0002H01L23/373B32B7/12B32B9/045B32B15/08B32B15/16B32B15/20B32B27/20B32B27/283B32B2250/40B32B2260/025B32B2260/046B32B2264/10B32B2307/30B32B2307/732B32B5/16B32B9/007B32B15/04B32B2307/302H01L23/3735H01L23/3737B32B7/027H01L2924/00
Inventor 田中仁也
Owner FUJI POLYMER INDUSTRIES CO LTD
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