Method for treating a device with a surface and corresponding device
A technology of physical vapor deposition and metal organics, applied in liquid chemical plating, vacuum evaporation plating, coating, etc., can solve problems such as unsatisfactory devices
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
example 1
[0025] Aluminum nitrate and phosphorus pentoxide were dissolved in ethanol respectively, and then mixed to obtain a solution with an aluminum ion content of 0.3 mol / liter and a molar ratio of aluminum element to phosphorus element of 1:2, that is, an aluminum phosphate precursor.
[0026] Dissolving bis(acetylacetonate)platinum(II) in acetone to form a saturated solution is a platinum precursor.
example 2
[0028] A 316 stainless steel pipe was vertically immersed in the aluminum phosphate precursor prepared by the method described in Example 1, and then pulled out at a speed of 400 mm per minute. The metal tube was cured in air at a temperature of 110° C. for 5 minutes, then the temperature was raised to 300° C. at a rate of about 60° C. per hour and maintained at 300° C. for about 20 minutes. Both the inner and outer surfaces of the pipe obtained a coating comprising an aluminum phosphate layer.
example 3
[0030] The 316 stainless steel tube with the aluminum phosphate coating obtained by the method described in Example 2 is vertically immersed in the platinum precursor prepared by the method described in Example 1, and then it is taken out from the platinum precursor at a speed of 400 mm per minute . The steel pipes are then wrapped in aluminum foil and placed in the oven. The temperature in the oven was heated from room temperature to 300°C at a rate of 10°C per minute and held at 300°C for 1 hour, followed by cooling to room temperature. A layer of platinum coating is obtained on the aluminum phosphate coating, that is, the coating of the steel pipe includes an aluminum phosphate layer and a platinum layer.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


