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A silver-containing titanium nitride/copper nano-multilayer antibacterial film and its preparation process

A nano-multi-layer, titanium nitride technology, applied in metal material coating process, coating, superimposed layer plating, etc., can solve the problems of insufficient research and attention, and achieve good antibacterial long-term effect and high antibacterial efficiency , The effect of prolonging the antibacterial time

Inactive Publication Date: 2018-09-14
BEIJING TECHNOLOGY AND BUSINESS UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing research does not pay enough attention to this direction

Method used

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  • A silver-containing titanium nitride/copper nano-multilayer antibacterial film and its preparation process

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Embodiment Construction

[0023] see figure 1 According to the silver-containing TiN / Cu wear-resistant and antibacterial nano-multilayer film provided by the present invention, comprising TiN, Cu and Ag, it is characterized in that: the main components of the nano-multilayer film are TiN and Cu, and the surface layer contains Ag. The specific structure of the nano-multilayer film is substrate 1 / Ti transition layer 2 / TiN and Cu film layer unit group 3 / silver-containing TiN-Cu film layer 4, and the structure of the TiN and Cu film layer unit group 3 is TiN / TiN-Cu / Cu nano-film layer unit repeated combination, each film layer unit is to insert the TiN-Cu nano-composite film into the TiN / Cu nano-multilayer film in the form of sub-film layer, and the whole said The TiN and Cu film layer unit group 3 is obtained by superimposing each TiN / TiN-Cu / Cu nano film layer unit, and the surface layer of the silver-containing TiN-Cu film layer 4 is the surface of the TiN-Cu nanocomposite film layer. Ag ion implantatio...

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Abstract

Disclosed is a silver-containing titanium nitride / copper nanometer multilayer antibacterial film. The silver-containing titanium nitride / copper nanometer multilayer antibacterial film comprises tin, Cu and Ag and is characterized in that the main components of the nanometer multilayer film are the tin and the Cu, and the surface layer contains the Ag. The concrete structure of the nanometer multilayer film is a substrate / Ti transition layer / tin and Cu film layer unit group / silver-containing tin-Cu film layer. According to each film layer unit, a tin-Cu nanometer composite film is connected into a tin / Cu nanometer multilayer film in a sleeved mode in a sub-film-layer form. The silver-containing tin-Cu film layer is obtained by conducting Ag ion implantation modification on the surface of the tin-Cu nanometer composite film layer. The abrasion-resistant antibacterial nanometer multilayer film has excellent abrasion resistance and antibacterial performance and can meet the requirements of abrasion and antibacterial working conditions in the actual processing process of a food machine very well.

Description

technical field [0001] The invention relates to a wear-resistant and antibacterial nano-multilayer film on the surface of food machinery equipment in contact with food, and more particularly relates to a silver-containing TiN / Cu wear-resistant and antibacterial nano-multilayer film material and a preparation process thereof. Background technique [0002] The safety of food has always been a major issue related to the national economy and the people's livelihood. As a food processing machine that is in close contact with food, the antibacterial performance of the surface is very important. Due to its excellent safety performance, stainless steel has been widely used in food machinery. However, due to its poor anti-wear performance and antibacterial performance, metal elements such as Ag, Cu and Zn are introduced into the surface of stainless steel through various surface treatment technologies. It is one of the research hotspots in the field of food machinery to improve the w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/00
CPCC23C28/322C23C28/341
Inventor 田斌孟春玲刘宝辉张媛王建利
Owner BEIJING TECHNOLOGY AND BUSINESS UNIVERSITY
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